W25P10 WINBOND [Winbond], W25P10 Datasheet - Page 3

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W25P10

Manufacturer Part Number
W25P10
Description
1M-BIT, 2M-BIT AND 4M-BIT SERIAL FLASH MEMORY WITH 40MHZ SPI
Manufacturer
WINBOND [Winbond]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
W25P10VSNIG
Manufacturer:
WB
Quantity:
1 000
Part Number:
W25P10VSNIG
Manufacturer:
WB
Quantity:
20 000
8.
9.
10.
11.
ELECTRICAL CHARACTERISTICS......................................................................................... 25
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
PACKAGE SPECIFICATION .................................................................................................... 32
9.1
ORDERING INFORMATION .................................................................................................... 33
REVISION HISTORY ................................................................................................................ 34
7.2.11
7.2.12
7.2.13
7.2.14
Absolute Maximum Ratings (1) .................................................................................... 25
Operating Ranges......................................................................................................... 25
Power-up Timing and Write Inhibit Threshold .............................................................. 26
DC Electrical Characteristics (Preliminary) (1) .............................................................. 27
AC Measurement Conditions........................................................................................ 28
AC Electrical Characteristics ........................................................................................ 29
AC Electrical Characteristics (cont’d) ........................................................................... 30
Serial Output Timing ..................................................................................................... 31
Input Timing .................................................................................................................. 31
Hold Timing................................................................................................................... 31
8-Pin SOIC 150-mil (Winbond Package Code SN) (NexFlash Package Code N) ....... 32
Chip Erase (C7h)..........................................................................................................20
Power-down (B9h) ........................................................................................................21
Release Power-down / Device ID (ABh) .......................................................................22
Read Manufacturer / Device ID (90h) ...........................................................................24
W25P10, W25P20 AND W25P40
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Publication Release Date: November 28, 2005
Revision M

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