TZA3044U PHILIPS [NXP Semiconductors], TZA3044U Datasheet
TZA3044U
Related parts for TZA3044U
TZA3044U Summary of contents
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... DATA SHEET TZA3044T; TZA3044U 1.25 Gbits/s Gigabit Ethernet postamplifiers Objective specification File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1998 Jul 07 ...
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... COMPENSATION RECTIFIER 1 k BAND GAP REFERENCE ( (1, 14) (11, 12) (13 SUB V CCA CF Fig.1 Block diagram. 2 Objective specification TZA3044T; TZA3044U 1.58 mm TZA3044 (24) 13 DOUT A2 A3 (23) 12 DOUTQ (16) 8 JAM (18 (17) 9 STQ (19, 20, 22, 25) (27, 28 DGND V CCD ...
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... DC voltage is V threshold level is set by connecting an external resistor between RSET and forcing a current into RSET; default value for this resistor is 180 k which corresponds with approximately 4 mV (p-p) differential input signal 3 Objective specification TZA3044T; TZA3044U DESCRIPTION (pin 14) CCD (pin 6) CCA CCA 1.5 V ...
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... DGND DOUTQ DOUT DGND TEST V CCD V CCD V ref RSET n.c. n.c. Note 1. Coordinates represent the position of the centre of the pad with respect to the centre of the die. 4 Objective specification TZA3044T; TZA3044U (1) COORDINATES PAD 235.7 +647.8 2 392.8 +647.8 3 532.8 +647.8 4 647.8 +507.1 5 647 ...
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... Fig.3 Bonding pad locations: TZA3044U. The outcome of this test is available at the PECL outputs ST and STQ. This flag can also be used to prevent the PECL outputs DOUT and DOUTQ from reacting to noise in the absence of a valid input signal, by connecting the output STQ to the input JAM. This insures that data will only be transmitted when the input signal-to-noise ratio is sufficient for low bit error rate system operation ...
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... The output circuit of DOUT and DOUTQ is given in Fig.8. (the internal CCA Some PECL termination schemes are given in Fig.9. between DETECT A (1) 6 Objective specification TZA3044T; TZA3044U , the current flowing into this pin will be: CCA 1.5 = ----------------------- - A R DETECT for a given input signal DETECT ...
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... DIN 1998 Jul 07 V O(max) V OQH OQL O(min) Fig.4 Logic level symbol definitions for PECL 4.5 k 330 A 2.55 V Fig.5 Data input circuit DIN and DINQ. 7 Objective specification TZA3044T; TZA3044U o(p-p) MGR243 DINQ 4.5 k 330 A MGR244 ...
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... Jul 1.5 V MGR245 Fig.6 Level-detect input circuit RSET LOW V HIGH Fig.7 PECL output circuit ST and STQ 105 105 9 mA 0.5 mA Fig.8 PECL output circuit DOUT and DOUTQ. 8 Objective specification TZA3044T; TZA3044U RSET ST, STQ 10 k MGR246 DOUT DOUTQ 0.5 mA MGR247 ...
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... Jul 3 127 82.5 GND 5 83 125 GND Fig.9 PECL output termination schemes. 9 Objective specification TZA3044T; TZA3044U MGR248 R1 = 127 R2 = 82.5 MGR249 125 MGR250 ...
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... The numbers in brackets refer to the pad numbers of the naked die version. THERMAL CHARACTERISTICS SYMBOL R thermal resistance from junction to solder point th(j-s) R thermal resistance from junction to ambient th(j-a) 1998 Jul 07 CONDITIONS note 1 note 1 PARAMETER 10 Objective specification TZA3044T; TZA3044U MIN. MAX. UNIT ...
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... V CCA V = 200 kHz square i wave electrically measured 20% to 80% 80% to 20% 11 Objective specification TZA3044T; TZA3044U MIN. TYP. MAX. 3 3.3 5 110 270 40 +120 40 +25 +85 0.002 1.0 0.004 2.0 2.1 2. 0.5 CCA ...
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... 20% to 80% 80 note 5 10 note 6 1.165 and pin RSET. The corresponding input signal CCA 12 Objective specification TZA3044T; TZA3044U TYP. MAX. 1840 V 1620 mV CC 1100 V 900 CC 600 200 V 1490 mV CC 1165 +10 1.20 1.235 UNIT mV ...
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... TZA3044 (1, 14) (16) (17) (18) (19, 20, 22, 25 AGND SUB JAM STQ ST Fig.10 Application diagram. 13 Objective specification TZA3044T; TZA3044U 100 nF V CCD 14 DOUT (24) 13 data out DOUTQ (23 DGND level-detect status MGR251 2 V ...
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Acrobat reader. white to force landscape pages to be ... ( DREF OUTQ 1 7 TZA3043T 4 pF IPhoto ...
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... Jul 2.5 scale (1) ( 0.49 0.25 10.0 4.0 1.27 0.36 0.19 9.8 3.8 0.0100 0.019 0.39 0.16 0.050 0.014 0.0075 0.38 0.15 REFERENCES JEDEC EIAJ MS-012AC 15 TZA3044T; TZA3044U detail 6.2 1.0 0.7 1.05 0.25 0.25 5.8 0.4 0.6 0.244 0.039 0.028 0.041 0.01 0.01 0.228 ...
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... C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes 1998 Jul 07 TZA3044T; TZA3044U Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used ...
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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 Jul 07 TZA3044T; TZA3044U 17 Objective specification ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, ...