ADG758 Analog Devices, ADG758 Datasheet - Page 5

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ADG758

Manufacturer Part Number
ADG758
Description
3 ohm/ 4-/8-Channel Multiplexers in Chip Scale Package
Manufacturer
Analog Devices
Datasheet

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Model
ADG758BCP
ADG759BCP
REV. A
ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
Analog Inputs
Digital Inputs
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
A2
X
0
0
0
0
1
1
1
1
X = Don’t Care
A1
X
0
0
1
1
X = Don’t Care
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG758/ADG759 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
DD
DD
SS
A
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
= 25°C, unless otherwise noted.)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
to V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
SS
A1
X
0
0
1
1
0
0
1
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
2
2
A0
X
0
1
0
1
. . . . . . . . . . . . . . V
. . . . . . . . . . . . . . . . . . –0.3 V to V
Table II. ADG759 Truth Table
Table I. ADG758 Truth Table
A0
X
0
1
0
1
0
1
0
1
(Pulsed at 1 ms, 10% Duty Cycle max)
Temperature Range
–40°C to +85°C
–40°C to +85°C
EN
0
1
1
1
1
30 mA, Whichever Occurs First
30 mA, Whichever Occurs First
EN
0
1
1
1
1
1
1
1
1
SS
1
– 0.3 V to V
Switch Condition
NONE
1
2
3
4
5
6
7
8
ON Switch Pair
NONE
1
2
3
4
DD
DD
+0.3 V or
+0.3 V or
ORDERING GUIDE
–5–
Package Description
20-Lead Chip Scale Package (CSP)
20-Lead Chip Scale Package (CSP)
Chip Scale Package,
Lead Temperature, Soldering
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Overvoltages at EN, A, S, or D will be clamped by internal diodes. Current should
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
be limited to the maximum ratings given.
θ
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 32°C/W
V
S1A
S2A
S3A
EN
S2
V
S1
S3
SS
NC = NO CONNECT
EXPOSED PAD TIED TO SUBSTRATE, V
EN
NC = NO CONNECT
EXPOSED PAD TIED TO SUBSTRATE, V
SS
PIN CONFIGURATIONS
1
2
3
4
5
1
2
3
4
5
20
20
6
PIN 1
IDENTIFIER
6
PIN 1
IDENTIFIER
(Not to Scale)
(Not to Scale)
ADG758
19
TOP VIEW
ADG759
19
7
TOP VIEW
7
18
8
18
8
17
9 10
17
9 10
ADG758/ADG759
WARNING!
16
16
15
14
13
12
11
15
14
13
12
11
V
S6
GND
S5
S7
GND
V
S1B
S2B
S3B
DD
DD
ESD SENSITIVE DEVICE
SS
SS
Package Option
CP-20
CP-20

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