MT47H128M8CF-25EIT:H Micron Semiconductor Products, MT47H128M8CF-25EIT:H Datasheet
MT47H128M8CF-25EIT:H
Manufacturer Part Number
MT47H128M8CF-25EIT:H
Description
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT47H64M16HR25EHTR.pdf
(132 pages)
Specifications of MT47H128M8CF-25EIT:H
Pack_quantity
253
Comm_code
85423239
Lead_time
56
Eccn
EAR99
Available stocks
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Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT47H128M8CF-25EIT:H
Manufacturer:
WOLFSON
Quantity:
2 000
Company:
Part Number:
MT47H128M8CF-25EIT:H
Manufacturer:
MICRON
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3 520
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MICRON23
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DDR2 SDRAM
MT47H256M4 – 32 Meg x 4 x 8 banks
MT47H128M8 – 16 Meg x 8 x 8 banks
MT47H64M16 – 8 Meg x 16 x 8 banks
Features
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 8 internal banks for concurrent operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Selectable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Industrial temperature (IT) option
• Automotive temperature (AT) option
• RoHS-compliant
• Supports JEDEC clock jitter specification
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. X 10/11 EN
DD
= 1.8V ±0.1V, V
Products and specifications discussed herein are subject to change by Micron without notice.
DDQ
= 1.8V ±0.1V
t
CK
1
Options
• Configuration
• FBGA package (Pb-free) – x16
• FBGA package (Pb-free) – x4, x8
• FBGA package (lead solder) – x16
• FBGA package (lead solder) – x4, x8
• Timing – cycle time
• Self refresh
• Operating temperature
• Revision
– 256 Meg x 4 (32 Meg x 4 x 8 banks)
– 128 Meg x 8 (16 Meg x 8 x 8 banks)
– 64 Meg x 16 (8 Meg x 16 x 8 banks)
– 84-ball FBGA (8mm x 12.5mm)
– 60-ball FBGA (8mm x 10mm)
– 84-ball FBGA (8mm x 12.5mm)
– 60-ball FBGA (8mm x 10mm)
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
– Standard
– Low-power
– Commercial (0°C T
– Industrial (–40°C T
– Automotive (–40°C T
Note:
–40°C T
+105°C)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Not all options listed can be combined to
1
define an offered product. Use the Part
Catalog Search on
product offerings and availability.
1Gb: x4, x8, x16 DDR2 SDRAM
A
+85°C)
C
C
C
‹ 2007 Micron Technology, Inc. All rights reserved.
+95°C;
, T
+85°C)
www.micron.com
A
Marking
Features
256M4
128M8
64M16
-187E
None
None
-25E
HW
HR
-25
CF
JN
AT
:H
-3
IT
for
L
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