GS820322T-138 ETC1 [List of Unclassifed Manufacturers], GS820322T-138 Datasheet
GS820322T-138
Related parts for GS820322T-138
GS820322T-138 Summary of contents
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... The GS82032 is an SCD (Single Cycle Deselect) pipelined synchronous SRAM. DCD (Dual Cycle Deselect) versions are also available. SCD SRAMs pipeline deselect commands one stage less than read commands. SCD RAMs begin turning off their outputs immediately after the deselect command has been captured in the input registers ...
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GS82032 100-Pin TQFP and QFP Pinout 100 DDQ ...
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TQFP Pin Description Pin Location 37, 36 35, 34, 33, 32, 100, 99, 82, 81, 44, 45, 46, 47, 48, 49 52, 53, 56, 57, 58, 59, 62, 63 68, 69, 72, 73, 74, 75, 78 ...
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GS82032 Block Diagram Register A0– LBO ADV CK ADSC ADSP Power Down ZZ Control Rev: 1.04 2/2001 Specifications ...
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Mode Pin Functions Mode Name Burst Order Control Output Register Control Power Down Control Note: There are pull-up devices on LBO and FT pins and a pull down device on the ZZ pin, so those input pins can be unconnected ...
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Synchronous Truth Table Address Operation Used Deselect Cycle, Power Down Deselect Cycle, Power Down Deselect Cycle, Power Down Read Cycle, Begin Burst External Read Cycle, Begin Burst External Write Cycle, Begin Burst External Read Cycle, Continue Burst Read Cycle, Continue ...
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Simplified State Diagram Notes: 1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low. 2. The upper portion of the diagram assumes active use of only the Enable (E inputs, and that ADSP ...
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Simplified State Diagram with G Notes: 1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use Use of “Dummy Reads” (Read Cycles with G High) may be used to make ...
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Absolute Maximum Ratings (All voltages reference Symbol Description V Voltage on V Pins Voltage in V Pins DDQ DDQ V Voltage on Clock Input Pin CK V Voltage on I/O Pins I/O V ...
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... Junction to Ambient (at 200 lfm) Junction to Ambient (at 200 lfm) Junction to Case (TOP) Notes: 1. Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temperature air flow, board density, and PCB thermal resistance. 2. SCMI G-38-87. 3. Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1. ...
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AC Test Conditions Parameter Input high level Input low level Input slew rate Input reference level Output reference level Output load Notes: 1. Include scope and jig capacitance. 2. Test conditions as specified with output loading as shown in Fig. ...
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Rev: 1.04 2/2001 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. GS82032T/Q-150/138/133/117/100/66 12/23 Preliminary © 2000, Giga Semiconductor, Inc. ...
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AC Electrical Characteristics Parameter Clock Cycle Time Clock to Output Valid Pipeline Clock to Output Invalid Clock to Output in Low-Z Clock Cycle Time Clock to Output Valid Flow Through Clock to Output Invalid Clock to Output in Low-Z Clock ...
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Write Cycle Timing Single Write ADSP ADSC ADV –An 0 WR1 – Hi-Z DQ –DQ A ...
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Flow Through Read Cycle Timing Single Read ADSP ADSC ADV –An RD1 – tOLZ DQ ...
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Flow Through Read-Write Cycle Timing Single Read ADSP ADSC ADV tS tH A0–An RD1 – tOE G tKQ Hi-Z DQ ...
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Pipelined SCD Read Cycle Timing Single Read ADSP ADSC ADV RD1 – Hi-Z DQ – Rev: ...
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Pipelined SCD Read-Write Cycle Timing Single Read ADSP ADSC ADV –An 0 RD1 – Hi-Z DQa–DQd ...
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... Dummy read cycles waste performance, but their use usually assures there will be no bus contention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste bandwidth on dummy cycles, and are logically simpler to manage in a multiple bank application (wait states need not be inserted at bank address boundary crossings), but greater care must be exercised to avoid excessive bus contention ...
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GS 82032 Output Driver Characteristics 60 Pull Down Drivers -20 -40 Pull Up Drivers -60 -80 -0.5 0 0.5 3. Rev: 1.04 2/2001 Specifications cited are subject to change without notice. For latest documentation see ...
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TQFP and QFP Package Drawing Symbol Description A1 A2 Body Thickness b c Lead Thickness D Terminal Dimension D1 Package Body E Terminal Dimension E1 Package Body Notes: 1. All dimensions ...
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... Ordering Information 1 Org Part Number 64K x 32 GS82032T-150 64K x 32 GS820322T-138 64K x 32 GS82032T-133 64K x 32 GS82032T-4 64K x 32 GS82032T-5 64K x 32 GS82032T-6 64K x 32 GS82032T-150I 64K x 32 GS82032T-138I 64K x 32 GS82032T-133I 64K x 32 GS82032T-4I 64K x 32 GS82032T-5I 64K x 32 GS82032T-6I ...
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... Rev: 1.04 2/2001 Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com. Revisions • This was the first release of 2 Meg Burst Datasheets in the Format new format. They included information for the Fine Pitch BGA package. • Took out the Fine Pitch BGA information. ...