GM71CS17403C Hynix Semiconductor, GM71CS17403C Datasheet

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GM71CS17403C

Manufacturer Part Number
GM71CS17403C
Description
4/194/304 WORDS x 4 BIT CMOS DYNAMIC RAM
Manufacturer
Hynix Semiconductor
Datasheet
Rev 0.1 / Apr’01
Description
generation dynamic RAM organized 4,194,304
words x 4 bit. GM71C(S)17403C/CL has
realized higher density, higher performance and
various functions by utilizing advanced CMOS
process technology. The GM71C(S)17403C/CL
offers Extended Data Out (EDO) Mode as a
high speed access mode. Multiplexed address
inputs permit the GM71C(S)17403C/CL to be
packaged in a standard 300 mil 24(26) pin SOJ
and a standard 300mil 24(26) pin plastic TSOP
II. The package size provides high system bit
densities and is compatible with widely
available automated testing and insertion
equipment. System oriented features include
single power supply 5V+/-10% tolerance, direct
interfacing capability with high performance
logic families such as Schottky TTL.
Pin Configuration
The GM71C(S)17403C/CL is the new
RAS
I/O1
I/O2
A10
V
WE
V
NC
A0
A1
A2
A3
CC
CC
10
11
12
13
1
2
3
4
5
6
8
9
24(26) SOJ
26
25
24
23
22
21
19
18
17
16
15
14
V
I/O4
I/O3
CAS
OE
A9
A8
A7
A6
A5
A4
V
SS
SS
(Top View)
Features
* 4,194,304 Words x 4 Bit Organization
* Extended Data Out Mode Capability
* Single Power Supply (5V+/-10%)
* Fast Access Time & Cycle Time
* Low Power
* RAS Only Refresh, CAS before RAS Refresh,
* All inputs and outputs TTL Compatible
* 2048 Refresh Cycles/32ms
* 2048 Refresh Cycles/128ms (L-version)
* Battery Backup Operation (L-version)
* Test Function : 16bit parallel test mode
Active : 660/605/550mW (MAX)
Standby : 11mW (CMOS level : MAX)
GM71C(S)17403C/CL-5
GM71C(S)17403C/CL-6
GM71C(S)17403C/CL-7
Hidden Refresh Capability
: 0.83mW (L-version : MAX)
RAS
I/O1
I/O2
A11
A10
V
V
WE
A0
A1
A2
A3
CC
CC
GM71C(S)17403C/CL
10
11
12
13
1
2
3
4
5
6
8
9
24(26) TSOP II
4,194,304 WORDS x 4 BIT
CMOS DYNAMIC RAM
t
RAC
50
60
70
t
CAC
13
15
18
26
25
24
23
22
21
19
18
17
16
15
14
V
I/O4
I/O3
CAS
OE
A9
A8
A7
A6
A5
A4
V
SS
SS
104
124
t
84
RC
(Unit: ns)
t
HPC
20
25
30

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GM71CS17403C Summary of contents

Page 1

Description The GM71C(S)17403C/CL is the new generation dynamic RAM organized 4,194,304 words x 4 bit. GM71C(S)17403C/CL has realized higher density, higher performance and various functions by utilizing advanced CMOS process technology. The GM71C(S)17403C/CL offers Extended Data Out (EDO) Mode as ...

Page 2

Pin Description Pin A0-A10 Address Inputs A0-A10 Refresh Address Inputs I/O1-I/O4 Data-input/Data-output RAS Row Address Strobe CAS Column Address Strobe Ordering Information Type No. GM71C(S)17403CJ/CLJ-5 GM71C(S)17403CJ/CLJ-6 GM71C(S)17403CJ/CLJ-7 GM71C(S)17403CT/CLT-5 GM71C(S)17403CT/CLT-6 GM71C(S)17403CT/CLT-7 Absolute Maximum Ratings* Symbol T Ambient Temperature under Bias A ...

Page 3

DC Electrical Characteristics (V Symbol V Output Level OH Output "H" Level Voltage (I V Output Level OL Output "L" Level Voltage (I Operating Current I CC1 Average Power Supply Operating Current (RAS, CAS Cycling Standby Current (TTL) I CC2 ...

Page 4

Capacitance (V = 5V+/-10 Symbol C Input Capacitance (Address Input Capacitance (Clocks Output Capacitance (Data-In/Out) I/O Note: 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. CAS = V to disable ...

Page 5

Read Cycle Symbol Parameter t Access Time from RAS RAC t Access Time from CAS CAC t Access Time from Address AA t Access Time from OE OAC t Read Command Setup Time RCS t Read Command Hold Time to ...

Page 6

Write Cycle Symbol Parameter Write Command Setup Time t WCS Write Command Hold Time t WCH Write Command Pulse Width Write Command to RAS Lead Time RWL t Write Command to CAS Lead Time CWL Data-in Setup ...

Page 7

EDO Page Mode Cycle Symbol Parameter t EDO Page Mode Cycle Time HPC EDO Page Mode RAS Pulse Width t RASP Access Time from CAS Precharge t ACP t RAS Hold Time from CAS Precharge RHCP t Output data Hold ...

Page 8

Notes Measurements assume initial pause of 200us is required after power up followed by a minimum of eight initialization cycles (any combination of cycles containing RAS-only refresh or CAS-before- RAS refresh). If the internal refresh ...

Page 9

In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data to the device. After RAS is reset impedance <=t OEH CWL 19. The 16M DRAM offers a 16-bit time saving ...

Page 10

Package Dimension 24(26) SOJ 0.661(16.80) MIN 0.669(17.00) MAX 0.050(1.27) TYP 0.015(0.38) MIN 0.020(0.50) MAX 24(26) TSOP (TYPE II) 0.670(17.04) MIN 0.678(17.24) MAX 0.012(0.30) MIN 0.020(0.50) MAX Rev 0.1 / Apr’01 0.128(3.25) MIN 0.147(3.75) MAX 0.026(0.66) MIN 0.032(0.81) MAX 0.037(0.95) MIN ...

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