MASW-001150-13160P MA-COM [M/A-COM Technology Solutions, Inc.], MASW-001150-13160P Datasheet

MASW-001150-13160P

Manufacturer Part Number

MASW-001150-13160P

Description

SURMOUNT PIN Diode Switch Element with Thermal Terminal

Manufacturer

MA-COM [M/A-COM Technology Solutions, Inc.]

Datasheet

1.MASW-001150-13160P.pdf (9 pages)

Current page: 1 of 9
Download datasheet (223Kb)

Description

This device is a PIN diode series-shunt switch

element with a unique integrated thermal terminal for

dissipating heat in the series diode created by the

DC and RF input power. The thermal terminal allows

for optimum heat dissipation by providing a direct

thermal path from the series diode to circuit thermal

ground while also being electrically isolated. The chip

is designed to provide a heat transfer conduit that

does not interfere with the PIN diode anode (input)

and cathode (output) electrical terminals, especially

with respect to RF performance. The silicon-glass

PIN diode chip is fabricated using M/A-COM

Technology Solutions patented HMIC™ process.

This device features silicon pedestals embedded in a

low loss, low dispersion glass. Selective backside

metallization is applied producing a surface mount

device. The topside is fully encapsulated with silicon

nitride and has an additional polymer layer to protect

against damage during handling and assembly

SURMOUNT PIN Diode Switch Element

with Thermal Terminal

Features

♦ Specified Bandwidth: 30MHz—2.5GHz

♦ Useable to 3.0GHz

♦ Low Loss <0.5dB

♦ High isolation >40dB

♦ High C.W. Incident Power, 50W at 500MHz

♦ Unique Thermal Terminal for Series Diode

♦ Surface Mount Device (No Wire Bonds)

♦ Rugged Silicon-Glass Construction

♦ Silicon Nitride Passivation

♦ Protective Polymer Scratch Protection

♦ RoHS Compliant

This PIN diode series-shunt switch element is

particularly advantageous in higher average power,

50W switch applications from 30MHZ – 3000GHz. In

addition, the backside RF, D.C., and thermal I/O

ports allow for direct solder re-flow attachments to

the micro-strip circuit for surface mount assembly. Of

particular interest, is the thermal terminal which

provides the power dissipating series diode a direct

connection to the circuit thermal ground for

unprecedented heat transfer. This thermal terminal is

electrically isolated from the other I/O ports. The chip

can be configured as either a reflective or an

absorptive switch.

ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

MASW-001150-1316

Applications

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

2. Reference Application Note M513 for reel size information.

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Forward Current

Reverse Voltage

Operating Temperature

Storage Temperature

Junction Temperature

Dissipated RF & DC Power

RF C.W. Incident Power

Mounting Temperature

MASW-001150-13160W

MASW-001150-13160P

Visit www.macomtech.com for additional data sheets and product information.

Part Number

Absolute Maximum Ratings

Parameter

ESD

Ordering Information

+260°C for 30 seconds

Absolute Maximum

Class 1A — HBM

WAFFLE PACK

POCKET TAPE

-55°C to +125°C

-55°C to +150°C

Class M3 — MM

Class C3 — CDM

500MHz, 4W

500MHz, 50W

Package

+175°C

100mA

- 180V

Related parts for MASW-001150-13160P

MASW-001150-13160P Summary of contents

Page 1

... Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. Ordering Information Part Number MASW-001150-13160W MASW-001150-13160P 2. Reference Application Note M513 for reel size information. . Absolute Maximum Ratings Parameter Forward Current ...

Page 2

... MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Electrical Specifications @ T Symbol Parameter C Total Capacitance T Series C Total Capacitance T Series C Total Capacitance T Shunt C Total Capacitance T Shunt R Series Resistance S Series R Series Resistance S Series R Series Resistance S Series R Series Resistance S Series R Series Resistance S Shunt R Series Resistance ...

Page 3

... PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. MASW-001150-13160 Isolation_+5mA Return loss_-50 mA Insertion Loss_-50mA 1 ...

Page 4

... MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Note: The bias circuits provided in the schematic above assumes current sources are available. If only voltage sources are available, a resistor will need to be added to the RF Input (J1) Bias Return Network. When using a D.C. voltage of 25V, a 500Ω resistor must be used to draw 50mA of current into the switch. ...

Page 5

Page 6

... MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal RF , DC, and Thermal Circuit Footprint ( Topview ) RF Output Trace Direction 20 ±1 mil (4) PL D.C Ground or RF Trace Direction 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements ...

Page 7

... Hatched yellow areas are I/O ports (die solder pads) Ordering Information Part Number Packaging MASW-001150-13160W MASW-001150-13160P Pocket Tape • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www ...

Page 8

... Ordering Information for Test Board Part Number MASW-001150-001SMB • North America Tel: 800.366.2266 / Fax: 978.366.2266 • Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 • Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 Visit www.macomtech.com for additional data sheets and product information. ...

Page 9

... MASW-001150-1316 SURMOUNT PIN Diode Switch Element with Thermal Terminal Assembly Guidelines Handling All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk handling should insure that abrasion and mechanical shock are minimized. ...

Related keywords

MASW-001150-13160P datasheet
MASW-001150-13160P data sheet
MASW-001150-13160P pdf datasheet
MASW-001150-13160P component
MASW-001150-13160P part
MASW-001150-13160P distributor
MASW-001150-13160P RoHS
MASW-001150-13160P datasheet download