MASW-009276-000DIE MA-COM [M/A-COM Technology Solutions, Inc.], MASW-009276-000DIE Datasheet

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MASW-009276-000DIE

Manufacturer Part Number
MASW-009276-000DIE
Description
Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz
Manufacturer
MA-COM [M/A-COM Technology Solutions, Inc.]
Datasheet
1.MASW-009276-000DIE.pdf (5 pages)
1
Features
• 802.11b/g and Bluetooth Applications
• Low Insertion Loss:
• High Isolation: 32 dB Typical on R
• Low Harmonics: <-70 dBc @ 20 dBm
• Flip-chip configuration
• RoHS* Compliant
Description
MA-COM’s MASW-009276-000DIE is a bumped
GaAs
applications are WLAN (802.11 b/g) and Bluetooth
applications.
The
isolation, low insertion loss, and high linearity at
2.4 - 2.5 GHz.
0.5 micron gate length GaAs pHEMT process.
The
performance and reliability.
SnAg (2.5%) solder bumps for Wafer Level Chip
Scale Package (WLCSP) applications.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
MASW-009276-000DIE
*
Ordering Information
Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
MASW-009276-001SMB
MASW-009276-000D3K
process
Part Number
MASW-009276-000DIE
0.5 dB 2.4 GHz to 2.5 GHz band
PHEMT
This device is fabricated using a
features
MMIC
SP3T
full
Die in 3000 piece reel
Sample Board SP3T
This die features
Package
passivation
switch.
delivers
X
Typical
high
for
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1. Exceeding any one or combination of these limits may cause
2. M/A-COM does not recommend sustained operation near
Die Bump Pad Layout (bump side up)
Absolute Maximum Ratings
Die Bump Pad Configuration
Input Power @ 3 V Control
Input Power @ 5 V Control
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
permanent damage to this device.
these survivability limits.
Operating Temperature
Visit www.macomtech.com for additional data sheets and product information.
Storage Temperature
Operating Voltage
Parameter
Name
GND
RFC
V
V
V
BT
R
T
C
C
C
X
X
1
3
2
Blue Tooth T
Voltage Control 1
Voltage Control 3
Voltage Control 2
Absolute Maximum
2.5 GHz R
2.5 GHz T
Description
Antenna Port
-65°C to +150°C
-40°C to +85°C
Ground
+32 dBm
+35 dBm
+8 volts
1,2
X
X
X
/R
Port
Port
X
Port
Rev. V1

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MASW-009276-000DIE Summary of contents

Page 1

... Low Insertion Loss: 0.5 dB 2.4 GHz to 2.5 GHz band • High Isolation Typical on R • Low Harmonics: <-70 dBc @ 20 dBm • Flip-chip configuration • RoHS* Compliant Description MA-COM’s MASW-009276-000DIE is a bumped GaAs PHEMT MMIC SP3T applications are WLAN (802.11 b/g) and Bluetooth applications. ...

Page 2

... MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Electrical Specifications Parameter Insertion Loss Isolation Return Loss IP3 RFC to Tx/Rx/BT, 2.4 GHz, 20 dBm Total Power, 1MHz Spacing Input P1dB Harmonics Control Current 3. External blocking capacitors on all RF ports. Recommended PCB Configuration Parts List Part Value ...

Page 3

... MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Product Consistency Distribution Charts Process Capability rocess Data Target * S ample M ean 24.1799 O v erall C apability and BT Isolation (dB) T and BT Isolation (dB) X Process Capability LB P rocess Data ...

Page 4

... MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Typical Performance Curves (plots = chip on board assembly) T Insertion Loss X 0.80 0.75 0.70 0.65 0.60 2.40 2.42 2.44 2.46 Frequency (GHz) R Insertion Loss X 0.75 0.70 0.65 0.60 +25°C -40°C +85°C 0.55 2.40 2.42 2.44 2.46 Frequency (GHz) BT Insertion Loss 0.80 0.75 0.70 0.65 0.60 2.40 2.42 2.44 2.46 Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development ...

Page 5

... MASW-009276-000DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Die Dimensions (Top and Side Views) Die Bump Pad Layout - Top View (bump side up) 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements ...

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