Q67040-A4208-A2 SIEMENS [Siemens Semiconductor Group], Q67040-A4208-A2 Datasheet

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Q67040-A4208-A2

Manufacturer Part Number
Q67040-A4208-A2
Description
IGBT (Low forward voltage drop High switching speed Low tail current Latch-up free Avalanche rated)
Manufacturer
SIEMENS [Siemens Semiconductor Group]
Datasheet
IGBT
Semiconductor Group
• Low forward voltage drop
• High switching speed
• Low tail current
• Latch-up free
• Avalanche rated
Type
BUP 313
Maximum Ratings
Parameter
Collector-emitter voltage
Collector-gate voltage
R
Gate-emitter voltage
DC collector current
T
T
Pulsed collector current, t
T
T
Avalanche energy, single pulse
I
L = 200 µH, T
Power dissipation
T
Chip or operating temperature
Storage temperature
C
C
C
C
C
C
GE
= 15 A, V
= 25 °C
= 90 °C
= 25 °C
= 90 °C
= 25 °C
= 20 k
Preliminary data
CC
j
= 25 °C
= 50 V, R
GE
p
= 1 ms
= 25
V
1200V 32A
CE
I
C
1
Package
TO-218 AB
Symbol
V
V
V
I
I
E
P
T
T
C
Cpuls
j
stg
CE
CGR
GE
AS
tot
Pin 1
G
Ordering Code
Q67040-A4208-A2
-55 ... + 150
-55 ... + 150
Values
± 20
1200
1200
200
32
20
64
40
22
Pin 2
C
Jul-30-1996
BUP 313
Unit
V
A
mJ
W
°C
Pin 3
E

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Q67040-A4208-A2 Summary of contents

Page 1

... TO-218 AB Symbol CGR Cpuls tot stg 1 BUP 313 Pin 1 Pin 2 Pin Ordering Code Q67040-A4208-A2 Values Unit 1200 V 1200 ± 200 -55 ... + 150 °C -55 ... + 150 Jul-30-1996 ...

Page 2

Maximum Ratings Parameter DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Thermal Resistance Thermal resistance, chip case Electrical Characteristics Parameter Static Characteristics Gate threshold voltage 0. CE, ...

Page 3

Electrical Characteristics Parameter Switching Characteristics, Inductive Load at T Turn-on delay time V = 600 Gon Rise time V = 600 ...

Page 4

Power dissipation tot C parameter: T 150 °C j 220 W 180 P tot 160 140 120 100 Safe operating area ...

Page 5

Typ. output characteristics parameter µ ° 17V 15V 24 I 13V C 11V ...

Page 6

Typ. switching time inductive load , par 600 ± ...

Page 7

Typ. gate charge Gate parameter puls 600 Short circuit ...

Page 8

Package Outlines Dimensions in mm Weight: Semiconductor Group 8 BUP 313 Jul-30-1996 ...

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