CM105CG331J50AT AVX, CM105CG331J50AT Datasheet - Page 15

• Manufacturer Part Number: CM105CG331J50AT
• Description: Cap 330pF 50VDC C0G 5% SMD 0603 T/R
• Manufacturer: AVX

Mounting Design
The chip could crack if the PCB warps during processing after the chip has been soldered.
Recommended chip position on PCB to minimize stress from PCB warpage
Actual Mounting
1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking.
2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf.
3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture.
4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected.
5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case.
6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors.
Resin Mold
1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a
2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin.
3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage.
low shrinkage resin.
Such gases may crack the chip capacitor or damage the device itself.
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
(Not recommended)
Crack
Support pin
(Ideal)