STM32F372VBT6 STMicroelectronics, STM32F372VBT6 Datasheet
STM32F372VBT6
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STM32F372VBT6 Summary of contents
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ARM Cortex-M4F 32b MCU+FPU 256KB Flash+32KB SRAM timers, 4 ADCs (12/16-bit), 3 DACs, 2 comp., 2.0-3.6 V operation Features ■ Core: ARM 32-bit Cortex™-M4F CPU (72 MHz max), single-cycle multiplication and HW division, DSP instruction with FPU (floating- ...
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Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F37x 3.17.2 3.17.3 3.17.4 3.17.5 3.18 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 23 3.19 Inter-integrated circuit interface (I ...
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Contents 6.3.7 6.3.8 6.3.9 6.3.10 6.3.11 6.3.12 6.3.13 6.3.14 6.3.15 6.3.16 6.3.17 6.3.18 6.3.19 6.3.20 6.3.21 6.3.22 6.3.23 6.3.24 6.3.25 7 Package characteristics . . . . . . . . . . . . . . . . . ...
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STM32F37x List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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List of tables Table 49. ESD absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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STM32F37x List of figures Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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... This datasheet provides the ordering information and mechanical device characteristics of the STM32F37x microcontrollers. This STM32F37x datasheet should be read in conjunction with the STM32F37x reference manual. The reference manual is available from the STMicroelectronics website www.st.com. For information on the Cortex™-M4F core please refer to the Cortex™-M4F Technical Reference Manual, available from the www ...
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STM32F37x 2 Description The STM32F37x family is based on the high-performance ARM® Cortex™-M4F 32-bit RISC core operating at a frequency MHz, and embedding a floating point unit (FPU), a memory protection unit (MPU) and an embedded ...
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Description Table 2. Device overview STM32F Peripheral 372Cx Flash (Kbytes) 64 128 256 64 128 256 64 128 256 64 128 256 64 128 256 64 128 256 SRAM (Kbytes General purpose Timers Basic SPI/I2S ...
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STM32F37x Figure 1. Block diagram max 4 C ls, ETR TIM @VDDSD12 @VDDSD3 @VDDA 1. AF: alternate function on I/O pins. 2. Example given for STM32F373xx device. @V DDA CRC @VDD Doc ID 022691 Rev 3 Description ...
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Functional overview 3 Functional overview 3.1 ARM® Cortex™-M4F core with embedded Flash and SRAM The ARM Cortex-M4F processor is the latest generation of ARM processors for embedded systems. It was developed to provide a low-cost platform that meets the needs ...
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STM32F37x 3.3 Embedded Flash memory All STM32F37x devices feature up to 256 Kbytes of embedded Flash memory available for storing programs and data. The Flash memory access time is adjusted to the CPU clock frequency (0 wait state from 0 ...
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Functional overview 3.7 Power management 3.7.1 Power supply schemes ● V external power supply for I/Os and the internal regulator provided externally DD : through V DD ● 2.0 to 3.6 V: DDA – external analog ...
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STM32F37x 3.7.4 Low-power modes The STM32F37x supports three low-power modes to achieve the best compromise between low power consumption, short startup time and available wakeup sources: ● Sleep mode In Sleep mode, only the CPU is stopped. All peripherals continue ...
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Functional overview Do not reconfigure GPIO pins which are not present on 48 and 64 pin packages to the analog mode. Additional current consumption in the range of tens of µA per pin can be observed if V DDA 3.10 ...
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STM32F37x 3.12 12-bit analog-to-digital converter (ADC) The 12-bit analog-to-digital converter is based on a successive approximation register (SAR) architecture. It has external channels (AIN15:0) and 3 internal channels (temperature sensor, voltage reference, V conversions in single-shot or ...
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Functional overview 3.13 16-bit sigma delta analog-to-digital converters (SDADC three 16-bit sigma-delta analog-to-digital converters are embedded in the STM32F37x. They have up to two separate supply voltages allowing the analog function voltage range to be independent from the ...
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STM32F37x 3.14 Digital-to-analog converter (DAC) The devices feature up to two 12-bit buffered DACs with three output channels that can be used to convert three digital signals into three analog voltage signal outputs. The internal structure is composed of integrated ...
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Functional overview 3.16 Touch sensing controller (TSC) The devices provide a simple solution for adding capacitive sensing functionality to any application. Capacitive sensing technology is able to detect the presence of a finger near an electrode which is protected from ...
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STM32F37x Table 4. No. of capacitive sensing channels available on STM32F37x devices Analog I/O group Number of capacitive sensing channels 3.17 Timers and watchdogs The STM32F37x includes two 32-bit and nine 16-bit ...
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Functional overview Table 5. Timer feature comparison (continued) Counter Timer type Timer resolution General- TIM16, 16-bit purpose TIM17 TIM6, Basic TIM7, 16-bit TIM18 3.17.1 General-purpose timers (TIM2 to TIM5, TIM12 to TIM17, TIM19) There are eleven synchronizable general-purpose timers embedded ...
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STM32F37x 3.17.3 Independent watchdog (IWDG) The independent watchdog is based on a 12-bit downcounter and 8-bit prescaler clocked from an independent 40 kHz internal RC and as it operates independently from the main clock, it can operate in ...
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Functional overview The RTC clock sources can be: ● A 32.768 kHz external crystal ● A resonator or oscillator ● The internal low-power RC oscillator (typical frequency of 40 kHz) ● The high-speed external clock divided by 32 3.19 Inter-integrated ...
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STM32F37x 3.20 Universal synchronous/asynchronous receiver transmitter (USART) The STM32F37x embeds three universal synchronous/asynchronous receiver transmitters (USART1, USART2 and USART3). All USARTs interfaces are able to communicate at speeds Mbit/s. They provide hardware management of the CTS ...
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Functional overview master mode, the master clock can be output to the external DAC/CODEC at 256 times the sampling frequency. Refer to Table 9 for the features between SPI1 and SPI2. Table 9. STM32F37x SPI/I2S implementation Hardware CRC calculation Rx/Tx ...
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STM32F37x 3.25 Serial wire JTAG debug port (SWJ-DP) The ARM SWJ-DP Interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the ...
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Pinouts and pin description 4 Pinouts and pin description Figure 2. STM32F37x LQFP48 pinout VBAT PC13 PC14 - OSC32_IN PC15 - OSC32_OUT PF0-OSC_IN PF1-OSC_OUT NRST VSSA/VREF- VDDA/VREF+ 28/128 ...
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STM32F37x Figure 3. STM32F37x LQFP64 pinout VBAT PC13 PC14 - OSC32_IN PC15 - OSC32_OUT PF0 - OSC_IN PF1 - OSC_OUT NRST PC0 PC1 PC2 PC3 VSSA/VREF- VDDA PA0 PA1 PA2 ...
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Pinouts and pin description Figure 4. STM32F37x LQFP100 pinout 30/128 Doc ID 022691 Rev 3 STM32F37x ...
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STM32F37x Figure 5. STM32F37x BGA100 pinout Doc ID 022691 Rev 3 Pinouts and pin description 31/128 ...
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Pinouts and pin description Table 10. Legend/abbreviations used in the pinout table Name Pin name Pin type I/O structure Notes Alternate functions Pin functions Additional functions Table 11. STM32F37x pin definitions Pin numbers Pin name (function after reset ...
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STM32F37x Table 11. STM32F37x pin definitions (continued) Pin numbers Pin name (function after reset PF10 PF0 - OSC_IN PF1 - OSC_OUT NRST PC0 ...
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Pinouts and pin description Table 11. STM32F37x pin definitions (continued) Pin numbers Pin name (function after reset PA4 PA5 PA6 PA7 PC4 ...
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STM32F37x Table 11. STM32F37x pin definitions (continued) Pin numbers Pin name (function after reset PE12 44 M10 PE13 45 M11 PE14 46 M12 PE15 47 L10 PB10 48 L11 VREFSD- 49 F12 VSSSD VSSSD VREFSD- 50 ...
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Pinouts and pin description Table 11. STM32F37x pin definitions (continued) Pin numbers Pin name (function after reset) 60 H12 PD13 61 H11 PD14 62 H10 PD15 63 E12 37 PC6 64 E11 38 PC7 65 E10 39 PC8 66 D12 ...
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STM32F37x Table 11. STM32F37x pin definitions (continued) Pin numbers Pin name (function after reset) 73 C11 47 35 PF6 74 F11 VSS_3 75 G11 VDD_3 48 36 PF7 76 A10 49 37 PA14 PA15 78 B11 ...
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Pinouts and pin description Table 11. STM32F37x pin definitions (continued) Pin numbers Pin name (function after reset PB4 PB5 PB6 PB7 ...
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Table 12. Alternate functions for port PA Pin AF0 AF1 AF2 AF3 Name TIM2_ TIM5_ TSC_ PA0 CH1_ CH1_ G1_IO1 ETR ETR TIM2_ TIM5_ TSC_ PA1 CH2 CH2 G1_IO2 TIM2_ TIM5_ TSC_ PA2 CH3 CH3 G1_IO3 TIM2_ TIM5_ TSC_ PA3 ...
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Table 12. Alternate functions for port PA (continued) Pin AF0 AF1 AF2 AF3 Name JTMS- TIM16_ TIM5_ TSC_ PA13 SWDIO CH1N CH4 G4_IO3 JTCK- TSC_ PA14 SWCLK G4_IO4 TIM2_ TSC_ PA15 JTDI CH1_ETR SYNC AF4 AF5 AF6 AF7 SPI1_MISO IR-OUT ...
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Table 13. Alternate functions for port PB Pin AF0 AF1 AF2 AF3 Name TSC_ PB0 TIM3_CH3 G3_IO3 TSC_ PB1 TIM3_CH4 G3_IO4 PB2 JTDO/ TIM2_ TSC_ PB3 TIM4_ETR TRACESWO CH2 G5_IO1 TIM16_ TSC_ PB4 JTRST TIM3_CH1 CH1 G5_IO2 TIM16_ PB5 TIM3_CH2 ...
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Table 14. Alternate functions for port PC Pin Name AF0 AF1 PC0 EVENTOUT TIM5_CH1_ETR PC1 EVENTOUT TIM5_CH2 PC2 EVENTOUT TIM5_CH3 PC3 EVENTOUT TIM5_CH4 PC4 EVENTOUT TIM13_CH1 PC5 EVENTOUT PC6 EVENTOUT TIM3_CH1 PC7 EVENTOUT TIM3_CH2 PC8 EVENTOUT TIM3_CH3 PC9 EVENTOUT TIM3_CH4 ...
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Table 15. Alternate functions for port PD Pin Name AF0 AF1 PD0 EVENTOUT TIM19_CH4 PD1 EVENTOUT TIM19_ETR PD2 EVENTOUT TIM3_ETR PD3 EVENTOUT PD4 EVENTOUT PD5 EVENTOUT PD6 EVENTOUT PD7 EVENTOUT PD8 EVENTOUT PD9 EVENTOUT PD10 EVENTOUT PD11 EVENTOUT PD12 EVENTOUT ...
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Table 16. Alternate functions for port PE Pin Name AF0 AF1 PE0 EVENTOUT PE1 EVENTOUT PE2 TRACECLK EVENTOUT PE3 TRACED0 EVENTOUT PE4 TRACED1 EVENTOUT PE5 TRACED2 EVENTOUT PE6 TRACED3 EVENTOUT PE7 EVENTOUT PE8 EVENTOUT PE9 EVENTOUT PE10 EVENTOUT PE11 EVENTOUT ...
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Table 17. Alternate functions for port PF Pin Name AF0 AF1 PF0 PF1 PF2 EVENTOUT PF4 EVENTOUT PF6 EVENTOUT PF7 EVENTOUT PF9 EVENTOUT PF10 EVENTOUT AF2 AF3 AF4 I2C2_SDA I2C2_SCL I2C2_SMBA TIM4_CH4 I2C2_SCL SPI1_MOSI/I2S1_SD I2C2_SDA TIM14_CH1 AF5 AF6 AF7 USART3_RTS ...
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Memory mapping 5 Memory mapping Figure 6. STM32F37x memory map 0xFFFF FFFF 7 0xE000 0000 6 0xC000 0000 5 0xA000 0000 4 0x8000 0000 3 0x6000 0000 2 0x4000 0000 1 0x2000 0000 0 0x0000 0000 46/128 Cortex-M4F Internal Peripherals ...
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STM32F37x Table 18. STM32F37x peripheral register boundary addresses Bus 0x4800 1400 - 0x4800 17FF 0x4800 1000 - 0x4800 13FF 0x4800 0C00 - 0x4800 0FFF AHB2 0x4800 0800 - 0x4800 0BFF 0x4800 0400 - 0x4800 07FF 0x4800 0000 - 0x4800 03FF ...
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Memory mapping Table 18. STM32F37x peripheral register boundary addresses (continued) Bus 0x4001 6800 - 0x4001 6BFF 0x4001 6400 - 0x4001 67FF 0x4001 6000 - 0x4001 63FF 0x4001 5C00 - 0x4001 5FFF 0x4001 4C00 - 0x4001 5BFF 0x4001 4800 - 0x4001 ...
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STM32F37x Table 18. STM32F37x peripheral register boundary addresses (continued) Bus 0x4000 5800 - 0x4000 5BFF 0x4000 5400 - 0x4000 57FF 0x4000 4C00 - 0x4000 53FF 0x4000 4800 - 0x4000 4BFF 0x4000 4400 - 0x4000 47FF 0x4000 4000 - 0x4000 43FF ...
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Electrical characteristics 6 Electrical characteristics 6.1 Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply ...
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STM32F37x 6.1.6 Power supply scheme Figure 9. Power supply scheme VDDSD12 μF VREFSD μ μF 1. Dotted lines represent the internal connections on low pin count packages, joining ...
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Electrical characteristics Caution: Each power supply pair (V ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure the good functionality of ...
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STM32F37x 6.2 Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 20: Current permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to ...
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Electrical characteristics Depending on the SDADCx operation mode, there can be more constraints between REFSD+ DDSD12 Table 20. Current characteristics Symbol Total current into sum of all VDD_x and VDDSDx power lines I VDD( (1) (source) Total ...
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STM32F37x 6.3 Operating conditions 6.3.1 General operating conditions Table 22. General operating conditions Symbol f Internal AHB clock frequency HCLK f Internal APB1 clock frequency PCLK1 f Internal APB2 clock frequency PCLK2 V Standard operating voltage DD Analog operating voltage ...
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Electrical characteristics Table 22. General operating conditions (continued) Symbol T Junction temperature range J 1. When the ADC is used, refer sustain a voltage higher than V 3. VDDSD12 is the external power supply for PB2, PB10, ...
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STM32F37x 6.3.3 Embedded reset and power control block characteristics The parameters given in temperature and V Table 24. Embedded reset and power control block characteristics Symbol Power on/power down reset (1) V POR/PDR threshold (3) V PDR hysteresis PDRhyst (3) ...
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Electrical characteristics 6.3.4 Embedded reference voltage The parameters given in temperature and V Table 26. Embedded internal reference voltage calibration values Calibration value name VREFINT_CAL Table 27. Embedded internal reference voltage Symbol Parameter V Internal reference voltage REFINT ADC sampling ...
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STM32F37x 6.3.5 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and ...
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Electrical characteristics Table 28. Typical and maximum current consumption from V Symbol Parameter Conditions HSE bypass, PLL on Supply current in HSE Run mode, bypass, code PLL off executing from RAM HSI clock, PLL on HSI clock, PLL off I ...
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STM32F37x Table 29. Typical and maximum current consumption from V Conditions Symbol Parameter (1) HSE bypass, PLL on Supply current in Run or HSE Sleep bypass, I mode, DDA PLL off code executing from Flash HSI clock, or RAM PLL ...
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Electrical characteristics Table 31. Typical and maximum V Symbol Parameter Conditions Regulator in run mode, all oscillators OFF Supply current in Regulator in Stop mode low-power mode, all I DDA oscillators OFF LSI ON and Supply IWDG ON current in ...
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STM32F37x Figure 11. Typical V 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 Typical current consumption The MCU is placed under the following conditions: ● DDA ● All I/O pins are in analog input configuration ...
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Electrical characteristics Table 33. Typical current consumption in Run mode, code with data processing running from Flash Symbol Parameter Supply current in I Run mode from DD V supply DD Supply current in (1)(2) I Run mode from DDA V ...
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STM32F37x Table 34. Typical current consumption in Sleep mode, code running from Flash or RAM Symbol Parameter Supply current in I Sleep mode from DD V supply DD Supply current in (1) I Sleep mode from DDA V supply DDA ...
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Electrical characteristics I/O system current consumption The current consumption of the I/O system has two components: static and dynamic. I/O static current consumption All the I/Os used as inputs with pull-up generate current consumption when the pin is externally held ...
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STM32F37x Table 35. Switching output I/O current consumption Symbol Parameter I/O current I SW consumption (estimated value). S I/O toggling (1) Conditions frequency (f 2 MHz 4 MHz MHz ...
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Electrical characteristics On-chip peripheral current consumption The MCU is placed under the following conditions: ● all I/O pins are in analog input configuration ● all peripherals are disabled unless otherwise mentioned ● the given value is calculated by measuring the ...
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STM32F37x Table 36. Peripheral current consumption Peripheral APB1-Bridge TIM12 TIM13 TIM14 TIM18 WWDG USART2 USART3 DAC2 DAC1 1. When peripherals are enabled, power consumption of the analog part of peripherals such as ADC, DACs, Comparators, etc. is not included. Refer ...
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Electrical characteristics 6.3.6 Wakeup time from low-power mode The wakeup times given in instruction executed by the CPU. The clock source used to wake up the device depends from the current operating mode: ● Stop or sleep mode: the wakeup ...
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STM32F37x Figure 12. High-speed external clock source AC timing diagram Low-speed external user clock generated from an external source In bypass mode the LSE oscillator is switched off and the input pin is a standard GPIO. The external clock signal ...
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Electrical characteristics Figure 13. Low-speed external clock source AC timing diagram High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with MHz crystal/ceramic resonator oscillator. All the information given ...
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STM32F37x For C and recommended to use high-quality external ceramic capacitors in the range (typ.), designed for high-frequency applications, and selected to match the requirements of the crystal or ...
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Electrical characteristics Low-speed external clock generated from a crystal resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal resonator oscillator. All the information given in this paragraph are based on design simulation results obtained with ...
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STM32F37x Figure 15. Typical application with a 32.768 kHz crystal Note: An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden to add one. 6.3.8 Internal clock source characteristics The parameters given in temperature and supply ...
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Electrical characteristics Figure 16. HSI oscillator accuracy characterization results Low-speed internal (LSI) RC oscillator Table 43. LSI oscillator characteristics Symbol f Frequency LSI (2) t LSI oscillator startup time su(LSI) (2) I LSI oscillator power consumption DD(LSI ...
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STM32F37x 1. Take care of using the appropriate multiplier factors have PLL input clock values compatible with the range defined Guaranteed by design, not tested in production. 6.3.10 Memory characteristics Flash memory The characteristics ...
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Electrical characteristics 6.3.11 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by ...
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STM32F37x Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second. To complete these trials, ESD stress ...
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Electrical characteristics Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: ● A supply overvoltage is applied to each power supply pin ● A current injection is applied to each input, output and ...
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STM32F37x Table 51. I/O current injection susceptibility Symbol Injected current on BOOT0 pin Injected current on PC0 pin Injected current on TC type I/O pins on VDDSD12 power domain: PB0, PB1, PB2, PE7, PE8, PE9, PE10, PE11, PE12, PE13, PE14, ...
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Electrical characteristics 6.3.14 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in performed under the conditions summarized in compliant. Table 52. I/O static characteristics Symbol Parameter Low level input V IL voltage High level input V ...
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STM32F37x Note: I/O pins are powered from V - PB2, PB10 and PE7 to PE15 I/O pins are powered from VDDSD12. - PB14 to PB15 and PD8 to PD15 I/O pins are powered from VDDSD3. All I/O pin ground is ...
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Electrical characteristics Figure 19. Five volt tolerant (FT and FTf) I/O input characteristics - CMOS port 2.0 Area not determined 1.0 0.5 2.0 Figure 20. Five volt tolerant (FT and FTf) I/O input characteristics - ...
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STM32F37x Output voltage levels Unless otherwise specified, the parameters given in performed under ambient temperature and V Table 22. All I/Os are CMOS and TTL compliant (FT, TTa or TC unless otherwise specified). Table 53. Output voltage characteristics Symbol (2) ...
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Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Table 54, respectively. Unless otherwise specified, the parameters given are derived from tests performed under ambient temperature and V Table 54. I/O AC characteristics ...
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STM32F37x Figure 21. I/O AC characteristics definition EXT ERNAL OUTPUT ON 50pF Maximum frequency is achieved 2/3)T and if the duty cycle is (45-55%) 6.3.15 NRST characteristics NRST pin characteristics The NRST pin ...
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Electrical characteristics Figure 22. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V Table 55. Otherwise the reset ...
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STM32F37x 6.3.16 Communications interfaces interface characteristics Unless otherwise specified, the parameters given in performed under ambient temperature, f summarized in Table 2 The I C interface meets the requirements of the standard I the following restrictions: the ...
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Electrical characteristics 2 Table 57 analog filter characteristics Symbol Pulse width of spikes that are t SP suppressed by the analog filter 1. Guaranteed by design, not tested in production. 2 Figure 23 bus AC waveforms ...
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STM32F37x 2 SPI/I S characteristics Unless otherwise specified, the parameters given in are derived from tests performed under ambient temperature, f supply voltage conditions summarized in Refer to Section 6.3.14: I/O port characteristics function characteristics (NSS, SCK, MOSI, MISO for ...
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Electrical characteristics Figure 24. SPI timing diagram - slave mode and CPHA = 0 NSS input t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA w(SCKL) CPOL=1 t a(SO) MISO OUT su(SI) MOSI I NPUT Figure ...
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STM32F37x Figure 26. SPI timing diagram - master mode 1. Measurement points are done at 0.5V (1) level and with external Doc ID 022691 Rev 3 Electrical characteristics . 93/128 ...
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Electrical characteristics 2 Table 59 characteristics Symbol Parameter I2S slave input clock duty (1) DuCy(SCK) cycle ( clock frequency 1/t c(CK) ( r(CK clock rise and fall time t ...
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STM32F37x 2 Figure 27 slave timing diagram (Philips protocol) CPOL = 0 CPOL = 1 WS input SD transmit SD receive 1. Measurement points are done at 0.5V 2. LSB transmit/receive of the previously transmitted byte. No LSB ...
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Electrical characteristics 6.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in from tests performed under ambient temperature, f conditions summarized in Note recommended to perform a calibration after each power-up. Table 60. ADC characteristics Symbol Parameter ...
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STM32F37x Equation 1: R SRC ------------------------------------------------------------- - R R SRC f ADC The formula above impedance allowed for an error below 1/4 of LSB. Here (from 12-bit resolution). Table 61. R SRC T (cycles) s ...
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Electrical characteristics 2. ADC accuracy vs. negative injection current: Injecting a negative current on any analog input pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog input recommended to ...
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STM32F37x 6.3.18 DAC electrical specifications Table 63. DAC characteristics Symbol Parameter V Analog supply voltage DDA V Reference supply voltage REF+ V Ground SSA (1) R Resistive load with buffer ON LOAD Impedance output with buffer ( OFF ...
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Electrical characteristics Table 63. DAC characteristics (continued) Symbol Parameter Offset error (difference between (3) Offset measured value at Code (0x800) and the ideal value = V /2) REF+ Gain Gain error (3) error Settling time (full scale: for a 10-bit ...
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STM32F37x 6.3.19 Comparator characteristics Table 64. Comparator characteristics Symbol Parameter V Analog supply voltage DDA Comparator input voltage V IN range V Scaler input voltage BG V Scaler offset voltage SC Scaler startup time from t S_SC power down t ...
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Electrical characteristics Table 64. Comparator characteristics (continued) Symbol Parameter V Comparator hysteresis hys 1. Guaranteed by design, not tested in production. 102/128 Conditions No hysteresis (COMPxHYST[1:0]=00) High speed mode Low hysteresis All other power (COMPxHYST[1:0]=01) modes High speed mode Medium ...
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STM32F37x 6.3.20 Temperature sensor characteristics Table 65. Temperature sensor calibration values Calibration value name TS_CAL1 TS_CAL2 Table 66. TS characteristics Symbol (1) Avg_Slope Average slope V Voltage at 25 °C 25 (1) t Startup time START ADC ...
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Electrical characteristics Table 68. TIMx Symbol t Timer resolution time res(TIM) Timer external clock f EXT frequency on CH1 to CH4 Res Timer resolution TIM t 16-bit counter clock period COUNTER Maximum possible count t MAX_COUNT with 32-bit counter 1. ...
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STM32F37x 6.3.23 USB characteristics Table 71. USB startup time Symbol (1) t STARTUP 1. Guaranteed by design, not tested in production. Table 72. USB DC electrical characteristics Symbol Input levels V USB operating voltage DD Differential input sensitivity (for (4) ...
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Electrical characteristics Figure 32. USB timings: definition of data signal rise and fall time Differen tial Data L ines V CRS Table 73. USB: Full-speed electrical characteristics Symbol Parameter Driver characteristics (2) t Rise time r (2) ...
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STM32F37x Table 74. SDADC characteristics (continued) Symbol Parameter Fast mode (f Slow mode (f Supply current I Standby DDSDx (V = DDSDx 3.3 V) Power down SD_ADC off Single ended mode (zero reference) Common input V AIN voltage Single ended ...
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Electrical characteristics Table 74. SDADC characteristics (continued) Symbol Parameter EO Offset error Offset drift Dvoffsett Differential or single ended mode, with emp gain = 1, V temperature All gains, differential mode, single ended EG Gain error mode Gain drift gain ...
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STM32F37x Table 74. SDADC characteristics (continued) Symbol Parameter Integral EL linearity error Differential ED linearity error (1) Conditions V = REFSD+ 1 REFSD+ 3 REFSD+ 1 REFSD+ 3 3.3 DDSDx V = ...
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Electrical characteristics Table 74. SDADC characteristics (continued) Symbol Parameter Signal to (4) SNR noise ratio 110/128 (1) Conditions ADC REFSD+ (2) 1.5 MHz 3 REFSD+ (3) 1 ADC MHz V = ...
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STM32F37x Table 74. SDADC characteristics (continued) Symbol Parameter Signal to SINAD noise and (4) distortion ratio Total (4) THD harmonic distortion 1. Data based on characterization results, not tested in production. (1) Conditions ADC REFSD+ (2) ...
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Electrical characteristics 2. For f lower than 5 MHz, there will be a performance degradation of around 2 dB due to flicker noise increase. ADC 3. If the reference value is lower than 2.4 V, there will be a performance ...
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STM32F37x 7 Package characteristics 7.1 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are ...
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Package characteristics Figure 33. UFBGA100 – ultra fine pitch ball grid array mm, 0.50 mm pitch, package outline A1 ball pad corner 1.75 1. Drawing is not to scale. Table 76. UFBGA100 – ultra fine pitch ball ...
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STM32F37x Figure 34. LQFP100 – 100-pin low-profile quad flat package outline 1. Drawing is not to scale. Table 77. LQPF100 – low-profile quad flat package mechanical data Symbol Min A A1 0.05 A2 ...
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Package characteristics Table 77. LQPF100 – low-profile quad flat package mechanical data (continued) Symbol Min E1 13. 0. 0° ccc 1. Values in inches are converted from mm and rounded to ...
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STM32F37x Figure 36. LQFP64 – pin low-profile quad flat package outline 1. Drawing is not to scale. Table 78. LQFP64 – low-profile quad flat package mechanical data Symbol Min A A1 ...
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Package characteristics Table 78. LQFP64 – low-profile quad flat package mechanical data (continued) Symbol Min E 11. 0° ccc 1. Values in inches are converted from mm and ...
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STM32F37x Figure 38. LQFP48 – mm, 48-pin low-profile quad flat package outline 1. Drawing is not to scale. Table 79. LQFP48 – mm, low-profile quad flat package mechanical data Symbol Min A A1 0.05 ...
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Package characteristics Table 79. LQFP48 – mm, low-profile quad flat package mechanical data (continued) Symbol Min 0° ccc 1. Values in inches are converted from mm and rounded to 4 decimal digits. ...
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STM32F37x 7.2 Thermal characteristics The maximum chip junction temperature (T Table 22: General operating conditions on page The maximum chip-junction temperature, T using the following equation: Where: ● T max is the maximum ambient temperature in °C, A is ...
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Package characteristics 7.2.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and, to ...
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STM32F37x Using the values obtained in – For LQFP100, 46°C 115 °C + (46°C/W × 98.8 mW) = 115 °C + 4.54 °C = 119.5 °C Jmax This is within the range of the suffix 7 version parts ...
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Part numbering 8 Part numbering For a list of available options (memory, package, and so on) or for further information on any aspect of this device, please contact your nearest ST sales office. Table 81. Ordering information scheme Example: Device ...
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STM32F37x 9 Revision history Table 82. Document revision history Date 18-Jun-2012 07-Sep-2012 Revision 1 Initial release. Added ‘F’ to all ‘Cortex-M4’ occurences Modified the shapes of to Figure 4: STM32F37x LQFP100 pinout Added two rows ‘VREFSD+ - VDDSD3’ and ‘VREF+ ...
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Revision history Table 82. Document revision history Date 07-Sep-2012 126/128 Revision Filled values in Table 70: WWDG min-max timeout value @72 MHz (PCLK) Filled values in Table 58: SPI characteristics Filled values in Table 59: I2S characteristics Replaced Table 60: ...
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STM32F37x Table 82. Document revision history Date 21-Dec-2012 Revision Updated Table 2: Device channels peripheral added. Updated Table 3: Capacitive sensing GPIOs available on STM32F37x devices Updated Section 3.19: Inter-integrated circuit interface (I2C) Updated the function names in definitions Updated ...
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