LCMXO2-2000HC-6TG100C Lattice, LCMXO2-2000HC-6TG100C Datasheet - Page 21

• Manufacturer Part Number: LCMXO2-2000HC-6TG100C
• Description: FPGA - Field Programmable Gate Array 2112 LUTs 80 IO 3.3V 6 Spd
• Manufacturer: Lattice

Specifications of LCMXO2-2000HC-6TG100C

• Rohs: yes
• Maximum Operating Frequency: 133 MHz
• Operating Supply Voltage: 2.5 V, 3.3 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Package / Case: TQFP-100
• Minimum Operating Temperature: 0 C
• Operating Supply Current: 82 uA
• Factory Pack Quantity: 90

4.0 PACKAGE QUALIFICATION DATA FOR MachXO2 PRODUCT FAMILY
The MachXO2 product family is offered in TQFP, uc/cs/ca/ftBGA, fpBGA, QFN and WLCSP packages
assembled and tested at ASE in Malaysia and ASEKH in Kaohsiung, Taiwan. This report details the package
qualification results of the initial MachXO2 product introductions. Package qualification tests include Surface
Mount Pre-Conditioning (SMPC), Temperature Cycling (T/C), Un-biased HAST (UHAST), Biased HAST
(BHAST) and High Temperature Storage (HTSL). Mechanical evaluation tests include Scanning Acoustic
Tomography (SAT) and visual package inspection. SMPC is used prior to all other package stresses.
The generation and use of generic data applied across a family of packages emanating from one base
assembly process is a Family Qualification, or Qualification by Extension. For the package stresses BHAST,
UHAST and HTSL, these are considered generic for a given Package Technology. T/C is considered generic up
to an evaluated die size + package size + 10%, for a given Package Technology. Surface Mount Pre-
Conditioning (SMPC) is considered generic up to an evaluated Peak Reflow temperature, for a given Package
Technology. The following table demonstrates the package stresses qualification matrix.
Table 4.0 Product-Package Qualification-By-Extension Matrix
Product-
Package
Combinati
ons
LCMXO2-
7000
LCMXO2-
4000
LCMXO2-
2000
LCMXO2-
1200
LCMXO2-
640
LCMXO2-
256
Notes: 1, 2 & 3 – Qualified by extension from one of the other product-packages within the same packaging technology
UHAST
UHAST
UHAST
UHAST
UHAST
UHAST
BHAST
BHAST
BHAST
BHAST
BHAST
BHAST
Stress
SMPC
SMPC
SMPC
SMPC
SMPC
SMPC
HTSL
HTSL
HTSL
HTSL
HTSL
HTSL
Test
T/C
T/C
T/C
T/C
T/C
T/C
not offered
not offered
not offered
not offered
not offered
(5x5mm,
1K hours
Package
Package
Package
Package
Package
96 hours
1K cycle
ASEKH
32-QFN
0.5mm
pitch)
MSL3
N/A
64-ucBGA
not offered
not offered
not offered
not offered
not offered
(4x4mm,
Package
Package
Package
Package
Package
1K hours
1K cycle
0.4mm
pitch)
MSL3
2
2
(14x14mm,
100-TQFP
not offered
not offered
Package
Package
0.5mm
pitch)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
not offered
264 hours
264 hours
1K cycles
(8x8mm,
Package
1K hours
csBGA
0.5mm
pitch)
MSL3
132-
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
21
(20x20mm,
Advanced Semiconductor Engineering, Malaysia (ASEM)
not offered
not offered
144-TQFP
264 hours
264 hours
1K cycles
1K cycles
1K hours
Package
Package
0.5mm
pitch)
MSL3
MSL3
1
1
1
1
1
1
1
1
1
1
1
1
1
184-csBGA
not offered
not offered
not offered
not offered
not offered
264 hours
1K cycles
1K cycles
(8x8mm,
Package
Package
Package
Package
Package
0.5mm
pitch)
MSL3
2
Lattice Semiconductor Corporation Doc. #25-106923 Rev. F
256-caBGA
(14x14mm,
not offered
not offered
not offered
Package
Package
Package
0.8mm
pitch)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
(17x17mm,
256-ftBGA
not offered
not offered
not offered
Package
Package
Package
1.0mm
pitch)
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
332-caBGA
(17x17mm,
not offered
not offered
not offered
not offered
1K cycles
Package
Package
Package
Package
0.8mil
pitch)
MSL3
2
2
2
2
2
2
2
2
INDEX Return
484-fpBGA
(23x23mm,
not offered
not offered
not offered
not offered
264 hours
264 hours
1K cycles
1K hours
Package
Package
Package
Package
1.0mm
pitch)
MSL3
3
3
3
3
3