MAX9700BEBC-T Maxim Integrated, MAX9700BEBC-T Datasheet - Page 14

• Manufacturer Part Number: MAX9700BEBC-T
• Description: Audio Amplifiers
• Manufacturer: Maxim Integrated

Specifications of MAX9700BEBC-T

• Output Type: 1-Channel Mono
• Output Power: 1.6 W x 1 at 6 Ohms
• Thd Plus Noise: 0.01 % at 8 Ohms at 125 mW
• Operating Supply Voltage: 3 V, 5 V
• Maximum Power Dissipation: 484 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: UCSP
• Audio Load Resistance: 16 Ohms
• Common Mode Rejection Ratio (min): 72 dB (Typ)
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential
• Supply Type: Single
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 2.5 V

1.2W, Low-EMI, Filterless,
Class D Audio Amplifier
One solution is the configuration shown in Figure 10b.
The potentiometer is connected between the differential
inputs, and these “see” identical RC paths when the
device powers up. The variable resistive element
appears between the two inputs, meaning the setting
affects both inputs the same way. The potentiometer is
audio taper, as in Figure 10a. This significantly
improves transient performance on power-up or release
from SHDN. A similar approach can be applied when
the MAX9700 is driven differentially and a volume con-
trol is required.
Figure 10a. Single-Ended Drive of MAX9700 Plus Volume
*EP = Exposed pad.
14
MAX9700CETB
MAX9700CEUB
MAX9700CEBC-T
MAX9700DETB
MAX9700DEUB
MAX9700DEBC-T
Ordering Information (continued)
______________________________________________________________________________________
PART
50kΩ
TEMP RANGE
-40
-40
-40
-40
-40
-40
CW
o
o
o
o
o
o
C to +85
C to +85
C to +85
C to +85
C to +85
C to +85
1μF
1μF
o
o
o
o
o
o
C
C
C
C
C
C
PIN-
PACKAGE
10 TDFN-EP*
10 µMAX
12 UCSP
10 TDFN-EP*
10 µMAX
12 UCSP
IN-
IN+
MAX9700
MARK
ACO
TOP
ACN
—
—
—
—
For the latest application details on UCSP construction,
dimensions, tape carrier information, PC board tech-
niques, bump-pad layout, and recommended reflow tem-
perature profile, as well as the latest information on
reliability testing results, refer to the Application Note:
UCSP — A Wafer-Level Chip-Scale Package available on
Maxim’s website at www.maxim-ic.com/ucsp.
Figure 10b. Improved Single-Ended Drive of MAX9700 Plus
Volume
*EP = Exposed pad.
MAX9700AETB
MAX9700AEUB
MAX9700AEBC-T
MAX9700BETB
MAX9700BEUB
MAX9700BEBC-T
MAX9700CETB
MAX9700CEUB
MAX9700CEBC-T
MAX9700DETB
MAX9700DEUB
MAX9700DEBC-T
UCSP Applications Information
PART
1μF
1μF
22kΩ
22kΩ
50kΩ
CW
PIN-PACKAGE
10 TDFN-EP*
10 TDFN-EP*
10 TDFN-EP*
10 TDFN-EP*
10 µMAX
12 UCSP
10 µMAX
12 UCSP
10 µMAX
12 UCSP
10 µMAX
12 UCSP
Selector Guide
IN-
IN+
MAX9700
GAIN (dB)
15.6
15.6
15.6
12
12
12
20
20
20
6
6
6