74AHCT3G04DP-G NXP Semiconductors, 74AHCT3G04DP-G Datasheet
74AHCT3G04DP-G
Specifications of 74AHCT3G04DP-G
Related parts for 74AHCT3G04DP-G
74AHCT3G04DP-G Summary of contents
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... Specified from 40 C to +85 C and from 40 C to +125 C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name 40 C to +125 C 74AHC3G04DP 74AHCT3G04DP 40 C to +125 C 74AHC3G04DC 74AHCT3G04DC 40 C to +125 C 74AHC3G04GD 74AHCT3G04GD Description TSSOP8 plastic thin shrink small outline package; 8 leads; ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74AHC3G04DP 74AHCT3G04DP 74AHC3G04DC 74AHCT3G04DC 74AHC3G04GD 74AHCT3G04GD [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram mna720 Fig 1. Logic symbol 6. Pinning information 6 ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin 1A, 2A GND 4 1Y, 2Y Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74AHCT3G04 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage = 50 8 LOW-level output voltage = 50 ...
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... NXP Semiconductors Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure Symbol Parameter Conditions 74AHCT3G04 t propagation nA to nY; pd delay power per buffer; PD dissipation pF capacitance V = GND [ the same as t and t ...
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... NXP Semiconductors negative Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 7. Test circuit for measuring switching times Table 10. Test data ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 0.5 mm terminal 1 index area Dimensions (mm are the original dimensions) (1) Unit max 0.05 0.35 2.1 mm nom 0.5 min 0.00 0.15 1.9 Outline version IEC SOT996-2 Fig 10. Package outline SOT996-2 (XSON8) 74AHC_AHCT3G04 Product data sheet 74AHC3G04 ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date 74AHC_AHCT3G04 v.3 20130326 • ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 13 Package outline ...