24LC01B/SN Microchip Technology, 24LC01B/SN Datasheet - Page 27

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24LC01B/SN

Manufacturer Part Number
24LC01B/SN
Description
IC EEPROM 1KBIT 400KHZ 8SOIC
Manufacturer
Microchip Technology
Datasheet

Specifications of 24LC01B/SN

Memory Size
1K (128 x 8)
Package / Case
8-SOIC (3.9mm Width)
Operating Temperature
0°C ~ 70°C
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Speed
400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.5 V ~ 5.5 V
Organization
128 K x 8
Interface Type
I2C
Maximum Clock Frequency
0.4 MHz
Access Time
900 ns
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2.5 V
Maximum Operating Current
3 mA
Maximum Operating Temperature
+ 70 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
0 C
Operating Supply Voltage
2.5 V
Package
8SOIC N
Density
1 Kb
Maximum Operating Frequency
0.4 MHz
Maximum Random Access Time
900 ns
Typical Operating Supply Voltage
3.3|5 V
Data Retention
200(Min) Year
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
24LC01B/SN
Manufacturer:
MCP
Quantity:
15 302
Part Number:
24LC01B/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
24LC01B/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
24AA01/24LC01B
APPENDIX A:
REVISION HISTORY
Revision C
Corrections to Section 1.0, Electrical Characteristics.
Section 9.1, 24LC01B standard marking code.
Revision D
Added DFN package.
Revision E
Revised Figure 3-2 Control Byte Allocation; Figure 4-1
Byte Write; Figure 4-2 Page Write; Section 6.0 Write
Protection; Figure 7-1 Current Address Read; Figure 7-
2 Random Read; Figure 7-3 Sequential Read.
Revision F (01/2007)
Revised Device Selection Table; Revised Features
Section; Changed 1.8V to 1.7V; Revised Table 1-1,
1-2, 8-1; Replaced Package Drawings; Revised
Product ID System.
Revision G (03/2007)
Replaced Package Drawings (Rev. AM).
Revision H (08/2008)
Added SC-70 Package; Updated Package Drawings.
Revision J (01/2009)
Added TDFN Package; Updated Package Drawings.
© 2009 Microchip Technology Inc.
DS21711J-page 27

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