74LVC2G00DP-G NXP Semiconductors, 74LVC2G00DP-G Datasheet
74LVC2G00DP-G
Specifications of 74LVC2G00DP-G
Related parts for 74LVC2G00DP-G
74LVC2G00DP-G Summary of contents
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Dual 2-input NAND gate Rev. 11 — 22 June 2012 1. General description The 74LVC2G00 provides a 2-input NAND gate function. Inputs can be driven from either 3 devices. This feature allows the use of ...
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... Marking Table 2. Marking codes Type number 74LVC2G00DP 74LVC2G00DC 74LVC2G00GT 74LVC2G00GF 74LVC2G00GD 74LVC2G00GM 74LVC2G00GN 74LVC2G00GS [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. ...
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... NXP Semiconductors 5. Functional diagram 001aah748 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74LVC2G00 GND 001aab736 Fig 4. Pin configuration SOT505-2 and SOT765-1 74LVC2G00 GND 4 Transparent top view Fig 6. Pin configuration SOT996-2 74LVC2G00 Product data sheet & ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin SOT505-2, SOT765-1, SOT833-1, SOT1089, SOT996-2, SOT1116 and SOT1203 1A 1B GND 4 1Y Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb Δt/ΔV input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I supply current CC ΔI additional supply current CC C input capacitance I = −40 °C to +125 °C T amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage V ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground 0 V); for test circuit see Symbol Parameter Conditions t propagation delay nA nY; see pd C power dissipation per gate capacitance [1] Typical values are measured at nominal V [ the same as t ...
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... NXP Semiconductors Table 9. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V Test data is given in Table Definitions for test circuit Load resistor Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Test voltage for switching times. ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1. 8× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 2.0 mm 0.5 0.04 0.17 1.9 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1. 0.5 mm terminal 1 index area (2) (4× terminal 1 index area Dimensions (1) Unit max 0.5 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 14. Package outline SOT996-2 (XSON8U) 74LVC2G00 Product data sheet ...
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... NXP Semiconductors XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1 terminal 1 index area terminal 1 index area L 1 Dimensions (1) Unit max 0.5 0.05 0.25 1.65 mm nom 0.20 1.60 min 0.00 0.15 1.55 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.2 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.25 mm nom 0.15 1.20 min 0.12 1.15 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1116 Fig 16. Package outline SOT1116 (XSON8) ...
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... NXP Semiconductors XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 (2) (8×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.40 mm nom 0.15 1.35 min 0.12 1.30 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version IEC SOT1203 Fig 17. Package outline SOT1203 (XSON8) ...
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... NXP Semiconductors 14. Abbreviations Table 11. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 15. Revision history Table 12. Revision history Document ID Release date 74LVC2G00 v.11 20120622 • Modifications: For type number 74LVC2G00GM the SOT code has changed to SOT902-2. ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... Product data sheet NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline ...