CY7C1370D-167AXI Cypress Semiconductor Corp, CY7C1370D-167AXI Datasheet - Page 9

IC SRAM 18MBIT 167MHZ 100LQFP

CY7C1370D-167AXI

Manufacturer Part Number
CY7C1370D-167AXI
Description
IC SRAM 18MBIT 167MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Type
Synchronousr
Datasheet

Specifications of CY7C1370D-167AXI

Memory Size
18M (512K x 36)
Package / Case
100-LQFP
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
167MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Access Time
3.4 ns
Maximum Clock Frequency
167 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3.135 V
Maximum Operating Current
275 mA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Number Of Ports
4
Operating Supply Voltage
3.3 V
Density
18Mb
Access Time (max)
3.4ns
Sync/async
Synchronous
Architecture
SDR
Clock Freq (max)
167MHz
Operating Supply Voltage (typ)
3.3V
Address Bus
19b
Package Type
TQFP
Operating Temp Range
-40C to 85C
Supply Current
275mA
Operating Supply Voltage (min)
3.135V
Operating Supply Voltage (max)
3.6V
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
100
Word Size
36b
Number Of Words
512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2136
CY7C1370D-167AXI

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Cycle Description table for details) inputs is latched into the
device and the write is complete.
The data written during the write operation is controlled by BW
(BW
The CY7C1370D/CY7C1372D provides byte write capability that
is described in the Write Cycle Description table. Asserting the
write enable input (WE) with the selected byte write select (BW)
input will selectively write to only the desired bytes. Bytes not
selected during a byte write operation will remain unaltered. A
synchronous self-timed write mechanism has been provided to
simplify the write operations. Byte write capability has been
included
sequences, which can be reduced to simple byte write
operations.
Because the CY7C1370D and CY7C1372D are common I/O
devices, data should not be driven into the device while the
outputs are active. The output enable (OE) can be deasserted
HIGH
(DQ
CY7C1372D) inputs. Doing so will tri-state the output drivers. As
a safety precaution, DQ and DQP (DQ
CY7C1370D
automatically tristated during the data portion of a write cycle,
regardless of the state of OE.
Burst Write Accesses
The CY7C1370D/CY7C1372D has an on-chip burst counter that
allows the user the ability to supply a single address and conduct
up to four write operations without reasserting the address
inputs. ADV/LD must be driven LOW in order to load the initial
address, as described in the
above. When ADV/LD is driven HIGH on the subsequent clock
rise, the chip enables (CE
ignored and the burst counter is incremented. The correct BW
(BW
Table 3. ZZ Mode Electrical Characteristics
Document Number: 38-05555 Rev. *K
I
t
t
t
t
DDZZ
ZZS
ZZREC
ZZI
RZZI
a,b,c,d
a,b,c,d
a,b,c,d
Parameter
before
/DQP
for CY7C1370D and BW
for CY7C1370D and BW
in
order
a,b,c,d
and
presenting
Sleep mode standby current
Device operation to ZZ
ZZ recovery time
ZZ active to sleep current
ZZ Inactive to exit sleep current
for CY7C1370D and DQ
DQ
to
a,b
1
greatly
, CE
/DQP
data
Single Write Accesses
2
, and CE
a,b
Description
a,b
a,b
simplify
to
for CY7C1372D) signals.
for
for CY7C1372D) inputs
the
3
a,b,c,d
) and WE inputs are
CY7C1372D)
read/modify/write
DQ and
/DQP
a,b
/DQP
a,b,c,d
section
a,b
DQP
ZZ  V
ZZ V
ZZ  0.2 V
This parameter is sampled
This parameter is sampled
are
for
for
DD
DD
must be driven in each cycle of the burst write in order to write
the correct bytes of data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ places
the SRAM in a power conservation “sleep” mode. Two clock
cycles are required to enter into or exit from this “sleep” mode.
While in this mode, data integrity is guaranteed. Accesses
pending when entering the “sleep” mode are not considered valid
nor is the completion of the operation guaranteed. The device
must be deselected prior to entering the “sleep” mode. CE
and CE
ZZ input returns LOW.
Table 1. Interleaved Burst Address Table
(MODE = Floating or V
Table 2. Linear Burst Address Table (MODE = GND)
 0.2 V
Test Conditions
 0.2 V
Address
Address
A1, A0
A1, A0
First
First
00
01
10
11
00
01
10
11
3
, must remain inactive for the duration of t
Address
Second
A1, A0
Address
Second
CY7C1370D, CY7C1372D
A1, A0
01
10
11
00
01
00
11
10
DD
)
2t
Min
CYC
0
Address
A1, A0
Third
Address
A1, A0
10
00
01
11
Third
10
00
01
11
2t
2t
Max
80
CYC
CYC
ZZREC
Address
Address
Fourth
A1, A0
Fourth
Page 9 of 29
A1, A0
00
01
10
Unit
11
mA
11
10
01
00
ns
ns
ns
ns
after the
1
, CE
2
[+] Feedback
,

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