TQP7M9104-PCB900 TriQuint Semiconductor, TQP7M9104-PCB900 Datasheet - Page 9

• Manufacturer Part Number: TQP7M9104-PCB900
• Description: Amplifier IC Development Tools 920-960MHZ 5VOLT EVAL BOARD
• Manufacturer: TriQuint Semiconductor
• Type: Power Amplifiersr

Specifications of TQP7M9104-PCB900

• Rohs: yes
• Product: Evaluation Boards
• Tool Is For Evaluation Of: TQP7M9104
• Operating Supply Voltage: 5 V
• Description/function: High Linear Amplifier, 920 MHz to 960 MHz
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Operating Supply Current: 427 mA
• Part # Aliases: 1080767

TQP7M9104
2W High Linearity Amplifier
Pin Configuration and Description
PC Board Layout
PCB Material (stackup):
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead and
package tolerances. Since surface mount processes vary from
supplier to supplier, careful process development is
recommended.
Advanced Data Sheet: Rev C 10/17/11
© 2011 TriQuint Semiconductor, Inc.
Applications Information
Pin
1
2, 3, 6,7, 8, 9, 10, 11,
12, 13,17, 19, 20, 21,
22, 23, 24
4, 5
14, 15, 16
18
Backside paddle
50 ohm line dimensions: width = .028”
1 oz. Cu top layer
0.014 inch Nelco N4000-13, ε
1 oz. Cu middle layer 1
Core Nelco N4000-13
1 oz. Cu middle layer 2
0.014 inch Nelco N-4000-13
1 oz. Cu bottom layer
Finished board thickness is 0.062±.006
Symbol
Vbias
GND/NC
RFin
RFout / Vcc
Iref
RF/DC GND
r
=3.7
Description
Voltage supply for active bias for the amp. Connect to same supply voltage as Vcc.
No internal connection. This pin can be grounded or N/C on PCB. Land pads should be
provided for PCB mounting integrity.
RF Input. DC voltage present, blocking capacitor required. Requires external match for
optimal performance.
RF Output. DC Voltage present, blocking cap required. Requires external match for optimal
performance.
Reference current into internal active bias current mirror. Current into Iref sets device
quiescent current. Also, can be used as on/off control.
Multiple Vias should be employed to minimize inductance and thermal resistance. Use
recommended via pattern shown under mounting configuration and ensure good solder
attach for optimum thermal and electrical performance
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Disclaimer: Subject to change without notice
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