M25PE16-VMP6TG NUMONYX, M25PE16-VMP6TG Datasheet - Page 39

no-image

M25PE16-VMP6TG

Manufacturer Part Number
M25PE16-VMP6TG
Description
IC FLASH 16MBIT 75MHZ 8VFQFPN
Manufacturer
NUMONYX
Series
Forté™r
Datasheet

Specifications of M25PE16-VMP6TG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
16M (2M x 8)
Speed
75MHz
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-VFQFN, 8-VFQFPN
Cell Type
NOR
Density
16Mb
Access Time (max)
8ns
Interface Type
Serial (SPI)
Address Bus
1b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
-40C to 85C
Package Type
MLP EP
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
2M
Supply Current
12mA
Mounting
Surface Mount
Pin Count
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
M25PE16-VMP6TGCT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M25PE16-VMP6TG
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
M25PE16-VMP6TG
Manufacturer:
ST
0
Part Number:
M25PE16-VMP6TG
Manufacturer:
ST
Quantity:
20 000
M25PE16
6.14
Subsector erase (SSE)
The subsector erase (SSE) instruction sets to ‘1’ (FFh) all bits inside the chosen subsector.
Before it can be accepted, a write enable (WREN) instruction must previously have been
executed. After the write enable (WREN) instruction has been decoded, the device sets the
write enable latch (WEL).
The subsector erase (SE) instruction is entered by driving Chip Select (S) Low, followed by
the instruction code, and three address bytes on serial data input (D). Any address inside
the subsector (see
Select (S) must be driven Low for the entire duration of the sequence.
The instruction sequence is shown in
Chip Select (S) must be driven High after the eighth bit of the last address byte has been
latched in, otherwise the subsector erase (SE) instruction is not executed. As soon as Chip
Select (S) is driven High, the self-timed subsector erase cycle (whose duration is t
initiated. While the subsector erase cycle is in progress, the status register may be read to
check the value of the write in progress (WIP) bit. The write in progress (WIP) bit is 1 during
the self-timed subsector erase cycle, and is 0 when it is completed. At some unspecified
time before the cycle is complete, the write enable latch (WEL) bit is reset.
A subsector erase (SSE) instruction applied to a subsector that contains a page that is
hardware or software protected is not executed.
Any subsector erase (SSE) instruction, while an erase, program or write cycle is in progress,
is rejected without having any effects on the cycle that is in progress.
If Reset (Reset) is driven Low while a subsector erase (SSE) cycle is in progress, the
subsector erase cycle is interrupted and data may not be erased correctly (see
Device status after a Reset Low
mode and a time of t
Chip Select (S) Low. For the value of t
Section 11: DC and AC
Figure 19. Subsector erase (SSE) instruction sequence
1. Address bits A23 to A21 are don’t care.
S
C
D
Table
RHSL
parameters.
0
4) is a valid address for the subsector erase (SE) instruction. Chip
is then required before the device can be re-selected by driving
1
2
Instruction
pulse). On Reset going Low, the device enters the reset
3
4
RHSL
Figure
5
6
see
7
18.
MSB
23 22
Table 21: Timings after a Reset Low pulse
8
9
24-bit address
2
29 30 31
1
0
Instructions
AI12356
Table 12:
SSE
) is
39/58
in

Related parts for M25PE16-VMP6TG