IC OFFLINE SWIT OTP HV 8SOIC

LNK564DN

Manufacturer Part NumberLNK564DN
DescriptionIC OFFLINE SWIT OTP HV 8SOIC
ManufacturerPower Integrations
SeriesLinkSwitch®-LP
LNK564DN datasheet
 


Specifications of LNK564DN

Output IsolationIsolatedFrequency Range93 ~ 107kHz
Voltage - Output700VPower (watts)3W
Operating Temperature-40°C ~ 150°CPackage / Case8-SOIC (0.154", 3.90mm Width) 7 leads
Input / Supply Voltage (max)265 VACInput / Supply Voltage (min)85 VAC
Duty Cycle (max)70 %Switching Frequency100 kHz
Supply Current160 uAOperating Temperature Range- 40 C to + 150 C
Mounting StyleSMD/SMTLead Free Status / RoHS StatusLead free / RoHS Compliant
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LNK562-564
D S .004 (.10)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
.367 (9.32)
-D-
.387 (9.83)
.125 (3.18)
.145 (3.68)
-T-
SEATING
PLANE
.100 (2.54) BSC
.014 (.36)
T E D S .010 (.25) M
.022 (.56)
D S .004 (.10)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
.100 (2.54) (BSC)
.367 (9.32)
-D-
.387 (9.83)
.125 (3.18)
.145 (3.68)
.032 (.81)
.048 (1.22)
.037 (.94)
.053 (1.35)
14
Rev. H 11/08
DIP-8B
Notes:
.137 (3.48)
1. Package dimensions conform to JEDEC specification
MINIMUM
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
.057 (1.45)
perpendicular to plane T.
.068 (1.73)
(NOTE 6)
.015 (.38)
MINIMUM
.008 (.20)
.120 (3.05)
.015 (.38)
.140 (3.56)
.048 (1.22)
.053 (1.35)
SMD-8B
.137 (3.48)
MINIMUM
.372 (9.45)
.388 (9.86)
.010 (.25)
E S
.046 .060
Pin 1
.086
Solder Pad Dimensions
.057 (1.45)
.068 (1.73)
(NOTE 5)
.004 (.10)
.009 (.23)
.004 (.10)
.012 (.30)
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
Notes:
1. Controlling dimensions are
inches. Millimeter sizes are
shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.006 (.15) on any side.
.420
3. Pin locations start with Pin 1,
and continue counter-clock-
.060 .046
wise to Pin 8 when viewed
from the top. Pin 6 is omitted.
4. Minimum metal to metal
.080
spacing at the package body
for the omitted lead location
is .137 inch (3.48 mm).
5. Lead width measured at
.186
package body.
.286
6. D and E are referenced
datums on the package
body.
°
°
0 -
8
.036 (0.91)
.044 (1.12)
P08B
PI-2551-121504
G08B
PI-2546-121504