IC OFFLINE SWIT OTP OCP HV 8DIP

TNY266PN

Manufacturer Part NumberTNY266PN
DescriptionIC OFFLINE SWIT OTP OCP HV 8DIP
ManufacturerPower Integrations
SeriesTinySwitch®-II
TNY266PN datasheets
 


Specifications of TNY266PN

Output IsolationIsolatedFrequency Range124 ~ 140kHz
Voltage - Output700VPower (watts)15W
Operating Temperature-40°C ~ 150°CPackage / Case8-DIP (0.300", 7.62mm), 7 Leads
Output Voltage5.8 VInput / Supply Voltage (max)265 VAC
Input / Supply Voltage (min)85 VACDuty Cycle (max)68 %
Switching Frequency132 KHzSupply Current265 uA
Operating Temperature Range- 40 C to + 150 CMounting StyleThrough Hole
Supply Voltage265VACDigital Ic Case StyleDIP
No. Of Pins8No. Of Regulated Outputs1
Filter TerminalsDIPRohs CompliantYes
On Resistance Rds(on)14ohmLead Free Status / RoHS StatusLead free / RoHS Compliant
Other names596-1051-5  
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D S .004 (.10)
-E-
.240 (6.10)
.260 (6.60)
Pin 1
.367 (9.32)
-D-
.387 (9.83)
.125 (3.18)
.145 (3.68)
-T-
SEATING
PLANE
.100 (2.54) BSC
.014 (.36)
T E D S .010 (.25) M
.022 (.56)
www.powerint.com
DIP-8B
Notes:
.137 (3.48)
1. Package dimensions conform to JEDEC specification
MINIMUM
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
.057 (1.45)
perpendicular to plane T.
.068 (1.73)
(NOTE 6)
.015 (.38)
MINIMUM
.008 (.20)
.120 (3.05)
.015 (.38)
.140 (3.56)
.048 (1.22)
.053 (1.35)
TNY263-268
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
P08B
PI-2551-121504
19
Rev. H 02/09