ZXLD1366EN8TC Diodes Zetex, ZXLD1366EN8TC Datasheet - Page 25

• Manufacturer Part Number: ZXLD1366EN8TC
• Description: SEMICONDUCTOR OTHER
• Manufacturer: Diodes Zetex

Specifications of ZXLD1366EN8TC

• Constant Current: *
• Constant Voltage: *
• Topology: *
• Number Of Outputs: *
• Internal Driver: *
• Type - Primary: *
• Type - Secondary: *
• Frequency: *
• Voltage - Supply: *
• Voltage - Output: *
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
• Operating Temperature: *
• Current - Output / Channel: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ZXLD1366EN8TCTR

Application Information
Thermal considerations
When operating the device at high ambient temperatures, or when driving maximum load current, care must be taken to
avoid exceeding the package power dissipation limits. The graph below gives details for power derating. This assumes the
device to be mounted on a 25mm2 PCB with 1oz copper standing in still air.
Note that the device power dissipation will most often be a maximum at minimum supply voltage. It will also increase if the
efficiency of the circuit is low. This may result from the use of unsuitable coils, or excessive parasitic output capacitance on
the switch output.
In order to maximize the thermal capabilities of the DFN3030-6 and the SO-8EP packages thermal vias should be
incorporated into the PCB. See figures 7 and 8 for examples used in the ZXLD1366 evaluation boards.
ZXLD1366
Document number: DS31992 Rev. 6 - 2
2.5
1.5
0.5
2
1
0
-40
Figure 7. Suggested layout for DFN3030-6 package
(Continued)
-25
DFN3030-6
-10
Maximum power dissipation
5
Ambient temperature (°C)
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20
25 of 30
35
SO-8EP
50
TSOT23-5
65
80
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ZXLD1366
March 2011