TC4424AVOA Microchip Technology, TC4424AVOA Datasheet - Page 12

• Manufacturer Part Number: TC4424AVOA
• Description: IC MOSFET DVR 3A DUAL HS 8SOIC
• Manufacturer: Microchip Technology
• Type: Low Sider

Specifications of TC4424AVOA

• Number Of Outputs: 2
• Configuration: Low-Side
• Input Type: Non-Inverting
• Delay Time: 40ns
• Current - Peak: 4.5A
• Number Of Configurations: 2
• Voltage - Supply: 4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Rise Time: 21 ns
• Fall Time: 21 ns
• Supply Voltage (min): 4.5 V
• Supply Current: 2 mA
• Maximum Power Dissipation: 610 mW
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Device Type: MOSFET
• Peak Output Current: 4.5A
• Output Resistance: 3.7ohm
• Input Delay: 50ns
• Output Delay: 50ns
• Supply Voltage Range: 4.5V To 18V
• Driver Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Module Configuration: Low Side
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TC4423A/TC4424A/TC4425A
DS21998B-page 12
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
Model Draft Angle Top
NOTE 1
A
A1
N
φ
1
TOP VIEW
2
D1
D
A2
Dimension Limits
E1
E
EXPOSED
A3
Units
A2
A1
A3
D1
D2
E1
E2
PAD
N
A
D
E
K
e
b
L
φ
NOTE 2
b
MIN
0.00
3.85
2.16
0.35
0.50
0.20
–
–
–
BOTTOM VIEW
D2
MILLIMETERS
2
1.27 BSC
0.20 REF
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
e
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
1
8
–
–
Microchip Technology Drawing C04-113B
N
E2
© 2007 Microchip Technology Inc.
NOTE 1
K
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12°
–
L