MAX4821ETP+ Maxim Integrated Products, MAX4821ETP+ Datasheet - Page 2

• Manufacturer Part Number: MAX4821ETP+
• Description: IC RELAY DRIVER 8CHAN 20-TQFN
• Manufacturer: Maxim Integrated Products
• Type: Relay/Lamp Driverr

Specifications of MAX4821ETP+

• Input Type: Parallel/Serial
• Number Of Outputs: 8
• On-state Resistance: 2 Ohm
• Current - Output / Channel: 70mA
• Current - Peak Output: 150mA
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
OUT_........................................................-0.3V to (V
CS, SCLK, DIN, SET, RESET, A0, A1, A2, LVL......-0.3V to +6.0V
DOUT..........................................................-0.3V to (V
Continuous OUT_ Current (all outputs turned on) ............150mA
Continuous OUT_ Current (single output turned on) ........300mA
ELECTRICAL CHARACTERISTICS
(V
+3.3V/+5V, 8-Channel, Cascadable Relay Drivers
with Serial/Parallel Interface
Note 1: Package thermal resistances were obtained using the method described in JEDEC specifications. For detailed information on
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Operating Voltage
Quiescent Current
Thermal Shutdown
Power-On Reset
Power-On Reset Hysteresis
DIGITAL INPUTS (SCLK, DIN, CS, LVL, A0, A1, A2, RESET, SET)
Input Logic-High Voltage
Input Logic-Low Voltage
Input Logic Hysteresis
Input Leakage Currents
C
DIGITAL OUTPUT (DOUT)
DOUT Low Voltage
DOUT High Voltage
RELAY OUTPUT DRIVERS (OUT1–OUT8)
OUT_ Drive Current
OUT_ On-Resistance
OUT_ Voltage
I
Kickback Diode Forward Voltage
CC
OUT
CC
IN
, COM..............................................................-0.3V to +6.0V
_______________________________________________________________________________________
Input Capacitance
= +3V to +5.5V, V
Off-Leakage Current
package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
COM
= V
CC
, T
A
SYMBOL
V
= -40°C to +85°C, unless otherwise noted. Typical values are at T
V
V
I
I
V
V
R
LEAK
LEAK
FORW
V
HYST
C
OUT
V
V
I
CC
OH
ON
Q
OL
IH
IN
IL
_
I
logic inputs = 0V or V
V
V
V
V
Input voltages = 0V or 5.5V
I
I
V
V
V
V
V
I
OUT
SINK
SOURCE
OUT
COM
CC
CC
CC
CC
CC
CC
CC
CC
OUT
CC
_ = 0µA,
_ = 150mA (Note 3)
= 3.3V
= 5V
= 3.3V
= 5V
= 2.7V
= 4.5V
= 2.7V
= 3.0V, I
_ = V
= 6mA
+ 0.3V)
+ 0.3V)
= 0.5mA
CC
OUT
, all outputs off
CONDITIONS
_ = 70mA
Continuous Power Dissipation (T
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Soldering Temperature (10s) ...........................................+300°C
Reflow Temperature.........................................................+260°C
CC
θ
θ
20-Lead Thin QFN (derate 16.9mW/°C above +70°C)..1350mW
20-Pin TSSOP (derate 21.7mW/°C above +70°C) .....1739mW
JA
JA
(Note 1) ...............................................................59.3°C/W
(Note 1) ..................................................................46°C/W
V
V
CC
CC
= 3.6V
= 5.5V
V
CC
MIN
-1.0
2.3
0.8
2.0
2.4
70
70
-1
- 0.5
A
= +70°C)
A
= +25°C.) (Note 2)
0.01
TYP
150
160
140
1.5
15
20
5
2
MAX
+1.0
5.5
2.2
0.6
0.8
0.4
0.4
1.5
+1
50
70
6
UNITS
mV
mV
mA
µA
µA
pF
µA
°C
Ω
V
V
V
V
V
V
V
V