MX879R IXYS, MX879R Datasheet - Page 29

• Manufacturer Part Number: MX879R
• Description: IC DVR RELAY/LOAD 8CH 60V 28-QFN
• Manufacturer: IXYS

Specifications of MX879R

• Input Type: Parallel/Serial
• Number Of Outputs: 8
• Current - Output / Channel: 120mA
• Voltage - Supply: 6 V ~ 60 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• On-state Resistance: -
• Current - Peak Output: -

Power Solid State Relays
(Power dissipation greater than 1 Watt)
Power SIP, ISOPLUS™-264 and i4-PAC™ Relays
Clare and IXYS have joined forces to bring OptoMOS™
technology, reliability, and compact size to the new Power SIP,
i4-PAC and ISOPLUS-264 series of power solid state relays.
Development of these new products was founded on the
blending of Clare’s traditional strengths in the design and
manufacture of photovoltaic integrated circuits (ICs), leadframe
design, and multichip packaging with IXYS’ expertise in power
MOSFETs, power packages, and substrate technology.
The optically coupled MOSFET technology provides 2500V
of input to output isolation. Similar to Clare’s solid state relays,
the optically coupled output is controlled by a GaAIAs infrared
LED.
Clare Power Relays are now offered in three package types: the
Power SIP, the i4-PAC, and the ISOPLUS-264. The Power SIP
package offers pin-to-pin compatibility with other solid state
relays providing an easy upgrade path for existing designs and
compatibility for new designs.
Features
• Handles loads up to 9A
• Voltage ratings up to 1000V
• Low On-resistance
• Non-conductive thermal pad for heat sink applications
• Industry standard 4-Pin SIP package
• Low input control current
• Low thermal impedances:
Specifications for: AC/DC Single Pole Power SIP, ISOPLUS-264 and i4-PAC Relays
Block Diagrams
➤ ➤ ➤ ➤ ➤ New
➤ ➤ ➤ ➤ ➤ CPC1927
① 5°C/W Heat Sink, ② All parts provide 2500 V
0.30°C/W - ISOPLUS-264
0.35°C/W - i4-PAC
1.5°C/W - Power SIP
Part
Number
②
CPC1906
CPC1908
CPC1909
CPC1916Y
CPC1918
CPC1926Y
CPC1967
CPC1973Y
CPC1977
CPC1978
CPC1979
CPC1981Y
CPC1986
CPC1988
Blocking
Voltage
1000
1000
1000
100
100
250
250
400
400
600
800
600
V
60
60
60
P
P
No Heat
Sink
5.25
1.35
0.35
1.25
0.75
0.18
0.65
A
2.0
3.5
6.5
2.5
0.7
2.7
1.4
0.9
rms
DC Only
Load Curent
with Heat
rms
Sink
15.0
13.0
3.35
1.85
2.25
of isolation voltage.
A
8.5
6.7
3.1
3.5
1.6
rms
①
T
rms
C
13.15
12.25
with
7.25
14.5
=25°C
A
6.5
9.4
15
15
15
15
-
-
-
-
-
rms
The i4-PAC and the ISOPLUS-264 packages feature a unique
assembly process whereby the silicon is soft soldered onto a
Direct Copper Bond (DCB) substrate rather than traditional
bonding onto an epoxy encapsulated copper frame. This
structure allows for a substantially lower junction-to-case ther-
mal impedance when compared to conventionally assembled
power relays. The i4-PAC thermal resistance is 0.35°C/W while
the ISOPLUS-264 has an even lower impedance of 0.30°C/W.
Although exposed on the backside of these packages, the
electrically non-conductive surface of the DCB ceramic substrate
provides 2500V
conductive power switching and control leads.
The combination of an electrically isolated non-conductive
exterior and low thermal impedance makes the new i4-PAC and
ISOPLUS-264 power relays an ideal solution for power
applications preferring a non-biased heat sink with superior
thermal management properties.
Applications
• Motor controls
• Robotics
• Medical equipment
• Railroad/traffic controls
• Consumer appliances
• Industrial control
• Test and measurement equipment
Resistance
0.34
0.85
0.75
18.0
0.3
0.3
0.1
0.1
1.4
0.2
5.0
1.0
2.3
3.0
On
2.5
Ω
rms
of isolation to the package’s electrically
Current
Control
Input
mA
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
Switching
Speeds
T
25 / 10
25 / 10
10 / 10
25 / 10
20 / 5
20 / 5
20 / 5
ON
10 / 5
20 / 5
25 / 5
10 / 5
20 / 5
20 / 5
5 / 3
5 / 3
ms
/T
OFF
Package
Type
Power SIP
i4-PAC
ISOPLUS-264
Power SIP
ISOPLUS-264
Power SIP
ISOPLUS-264
i4-PAC
Power SIP
i4-PAC
i4-PAC
ISOPLUS-264
Power SIP
i4-PAC
ISOPLUS-264
7