IR3502MTRPBF International Rectifier, IR3502MTRPBF Datasheet - Page 37

IC XPHASE3 CONTROLLER 32-MLPQ

IR3502MTRPBF

Manufacturer Part Number
IR3502MTRPBF
Description
IC XPHASE3 CONTROLLER 32-MLPQ
Manufacturer
International Rectifier
Series
XPhase3™r
Datasheet

Specifications of IR3502MTRPBF

Applications
Processor
Current - Supply
8mA
Voltage - Supply
8 V ~ 16 V
Operating Temperature
0°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
32-MLPQ
Package
32-Lead MLPQ
Circuit
X-Phase Control IC
Switch Freq (khz)
250kHz to 1.5MHz
Pbf
PbF Option Available
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
IR3502MTRPBFTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IR3502MTRPBF
Manufacturer:
QFN
Quantity:
20 000
Solder Resist
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
• The minimum solder resist width is 0.13mm.
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
• The four vias in the land pad should be tented or plugged from bottom board side with solder resist.
resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
Page 37 of 39
July 28, 2009
IR3502

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