LTC3127EMSE#PBF Linear Technology, LTC3127EMSE#PBF Datasheet - Page 19

IC BUCK BOOST SYNC ADJ 12MSOP

LTC3127EMSE#PBF

Manufacturer Part Number
LTC3127EMSE#PBF
Description
IC BUCK BOOST SYNC ADJ 12MSOP
Manufacturer
Linear Technology
Datasheet

Specifications of LTC3127EMSE#PBF

Applications
Energy Harvesting
Current - Supply
400µA
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
12-MSOP Exposed Pad
Primary Input Voltage
3.6V
No. Of Outputs
1
Output Voltage
5.25V
Output Current
1A
No. Of Pins
12
Operating Temperature Range
-40°C To +85°C
Msl
MSL 1 - Unlimited
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC3127EMSE#PBFLTC3127EMSE
Manufacturer:
LT
Quantity:
10 000
Company:
Part Number:
LTC3127EMSE#PBFLTC3127EMSE
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC3127EMSE#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC3127EMSE#PBFLTC3127EMSE10#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
package DescripTion
(.0165 .0015)
0.42 0.038
TYP
GAUGE PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
(.007)
0.18
RECOMMENDED SOLDER PAD LAYOUT
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(.206)
5.23
MIN
2.845 0.102
(.112 .004)
(.010)
0.254
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DETAIL “A”
DETAIL “A”
1.651 0.102
(.065 .004)
12-Lead Plastic MSOP, Exposed Die Pad
(.0256)
(Reference LTC DWG # 05-08-1666 Rev B)
0.65
BSC
0 – 6 TYP
(.021 .006)
0.53 0.152
0.889 0.127
(.035 .005)
(.126 – .136)
3.20 – 3.45
SEATING
PLANE
MSE Package
(.009 – .015)
0.22 – 0.38
(.193 .006)
4.90 0.152
TYP
(.043)
MAX
1.10
EXPOSED PAD OPTION
(.0256)
1
0.650
12
BSC
BOTTOM VIEW OF
12 11 10 9 8 7
1 2 3 4 5 6
2.845 0.102
4.039 0.102
(.112 .004)
(.159 .004)
(NOTE 3)
7
6
DETAIL “B”
(.118 .004)
3.00 0.102
(NOTE 4)
0.406 0.076
(.016 .003)
MSOP (MSE12) 0608 REV B
(.034)
0.86
REF
0.1016 0.0508
(.004 .002)
REF
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
0.12 REF
LTC3127
0.35
REF

3127f

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