IR3500MPBF International Rectifier, IR3500MPBF Datasheet

no-image

IR3500MPBF

Manufacturer Part Number
IR3500MPBF
Description
IC XPHASE3 CONTROL 32-MLPQ
Manufacturer
International Rectifier
Series
XPhase3™r
Datasheet

Specifications of IR3500MPBF

Applications
Processor
Current - Supply
6.5mA
Voltage - Supply
4.75 V ~ 7.5 V
Operating Temperature
0°C ~ 100°C
Mounting Type
Surface Mount
Package / Case
32-MLPQ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
DESCRIPTION
FEATURES
The IR3500 Control IC combined with an xPHASE3
implement a complete VR11.0 or AMD PVID power solution. The Control IC provides overall system
control and interfaces with any number of Phase ICs which each drive and monitor a single phase of a
multiphase converter. The XPhase3
expensive, and easier to design while providing higher efficiency than conventional approaches.
Page 1 of 47
1 to X phase operation with matching Phase IC
VID Select pin configures AMD 5 or 6 bit PVID, Intel VR11 with/out startup to 1.1V Boot voltage
0.5% overall system set point accuracy
Programmable 250kHz to 9MHz Daisy-chain digital phase timing clock oscillator frequency provides a
per phase switching frequency of 250kHz to 1.5MHz without external components
Programmable Dynamic VID Slew Rate
Programmable VID Offset or No Offset
Programmable Load Line Output Impedance
High speed error amplifier with wide bandwidth of 30MHz and fast slew rate of 12V/us
Programmable converter current limit during soft start, hiccup with delay during normal operation
Central over voltage detection with programmable threshold and communication to phase ICs
Over voltage signal output to system with overvoltage detection during powerup and normal operation
Detection and protection of open remote sense line and open control loop
IC bias linear regulator control with programmable output voltage and UVLO
Programmable VRHOT function monitors temperature of power stage through a NTC thermistor
Remote sense amplifier with true converter voltage sensing and less than 50uA bias current
Simplified VR Ready output provides indication of proper operation and avoids false triggering
Small thermally enhanced 32L 5mm x 5mm MLPQ package
VR READY
VIDSEL
ENABLE
VRHOT
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
12V
RTHERMISTOR2
RTHERMISTOR1
Close to
Power Stage
1
2
3
4
5
6
7
8
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
RVCCLDRV
RHOTSET2
RHOTSET1
VCCL
XPHASE3
TM
Figure 1 – Application Circuit
Q1
IR3500
CONTROL
IC
architecture implements a power supply that is smaller, less
RVCCLFB1
ROSC / OVP
RFB1
RVCCLFB2
SS/DEL
VSETPT
OCSET
LGND
VDAC
VDRP
RFB
RFB2
IIN
CFB
TM
TM
24
23
22
21
20
19
18
17
Phase IC provides a full featured and flexible way to
ROCSET
RVSETPT
VR11.0 & AMD PVID CONTROL IC
ROSC
CDRP
RDRP
CSS/DEL
CVCCL
4.7uF
RVDAC
Q2
ROVP1
Q3
Optional
CVDAC
VDAC
RCP
FUSE
CCP1
ROVP2
CCP
SCR
VCC SENSE +
VSS SENSE -
To Converter
VCCL
6 Wire
Bus to
Phase
ICs
To Load
May 18, 2009
DATA SHEET
IR3500

Related parts for IR3500MPBF

IR3500MPBF Summary of contents

Page 1

DESCRIPTION The IR3500 Control IC combined with an xPHASE3 implement a complete VR11.0 or AMD PVID power solution. The Control IC provides overall system control and interfaces with any number of Phase ICs which each drive and monitor a single ...

Page 2

... ORDERING INFORMATION Device IR3500MTRPBF * IR3500MPBF *Samples only ABSOLUTE MAXIMUM RATINGS Stresses beyond those listed below may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications are not implied. ...

Page 3

RECOMMENDED OPERATING CONDITIONS FOR RELIABLE OPERATION WITH MARGIN 4.75V ≤ V ≤ 7.5V, -0.3V ≤ VOSEN- ≤ 0.3V, 0 CCL ELECTRICAL SPECIFICATIONS The electrical characteristics involve the spread of values guaranteed within the recommended operating conditions. Typical values represent the ...

Page 4

PARAMETER Soft Start and Delay Start Delay (TD1) Soft Start Time (TD2) VID Sample Delay (TD3) VRRDY Delay (TD4 + TD5) OC Delay Time V(IIN) – V(OCSET) = 500 mV SS/DEL to FB Input Offset With FB = 0V, adjust ...

Page 5

PARAMETER Minimum Voltage Maximum Voltage Measure V(VCCL) – V(EAOUT) Open Voltage Loop Detection Measure V(VCCL) - V(EAOUT), Threshold Relative to Error Amplifier maximum voltage. Open Voltage Loop Detection Measure PHSOUT pulse numbers from Delay V(EAOUT) = V(VCCL) to VRRDY = ...

Page 6

PARAMETER VDRP Buffer Amplifier Input Offset Voltage Source Current Sink Current Unity Gain Bandwidth Slew Rate IIN Bias Current VRRDY Output Output Voltage Leakage Current Open Sense Line Detection Sense Line Detection Active Comparator Threshold Voltage Sense Line Detection Active ...

Page 7

SYSTEM SET POINT TEST IR3500 VDAC BUFFER AMPLIFIER + ISOURCE FAST VDAC ISINK - IVDAC CURRENT SOURCE IROSC GENERATOR Figure 2 - System Set Point Test Circuit for VR11 VID IR3500 VDAC BUFFER AMPLIFIER + ISOURCE FAST VDAC ISINK - ...

Page 8

PIN DESCRIPTION PIN# PIN SYMBOL 1-8 VID7-0 Inputs to VID Converter. 9 ENABLE Enable input. A logic low applied to this pin puts the IC into fault mode. Do not float this pin as the logic state ...

Page 9

VCCLDRV Output of the VCCL regulator error amplifier to control external transistor. The pin senses 12V power supply through a resistor. 31 VRRDY Open collector output that drives low during startup and under any external fault condition. Connect external ...

Page 10

Frequency and Phase Timing Control The oscillator and system clock frequency is programmable from 250kHz to 9MHZ by an external resistor (ROSC). The control IC system clock signal (CLKOUT) is connected to CLKIN of all the phase ICs. The phase ...

Page 11

The inductor current will increase much more rapidly than decrease in response to load transients. An additional advantage of the architecture is that differences in ground or input voltage at the phases have no effect on operation since ...

Page 12

Usually the resistor Rcs and capacitor Ccs are chosen so that the time constant of Rcs and Ccs equals the time constant of the inductor which is the inductance L over the inductor DCR (R voltage across Ccs is proportional ...

Page 13

Average Current Share Loop Current sharing between phases of the converter is achieved by the average current share loop in each phase IC. The output of the current sense amplifier is compared with average current at the share bus. If ...

Page 14

ENABLE VBIAS VCCL COMPARATOR ENABLE 250nS - BLANKING INTEL + DELAY 850mV AMD 1.2V COMPARATOR 800mV 1.14V + VCCLDRV - 80mV VCCL REGULATOR 120mV AMPLIFIER DISCHARGE VCCLFB + 4.0V COMPARATOR - - 1.19V 0.94 + VCCL OUTPUT 0.86 0.2V COMPARATOR ...

Page 15

TABLE 1 - VIDSEL FUNCTIONALITY VIDSEL VID Table Connection LGND (<0.5V) AMD 5-BIT OPTERON 6. GND AMD 6-BIT (0.7V to 83% of FLOAT) FLOAT (typ. VR11 8-BIT 83% of VR11w/wo boot Threshold) VCCL (4.5V-7V) VR11 8-BIT TABLE 2 ...

Page 16

TABLE 3 - VR11 VID TABLE (PART1) Hex (VID7:VID0) Dec (VID7:VID0) 00 00000000 01 00000001 02 00000010 03 00000011 04 00000100 05 00000101 06 00000110 07 00000111 08 00001000 09 00001001 0A 00001010 0B 00001011 0C 00001100 0D 00001101 0E ...

Page 17

TABLE 3 - VR11 VID TABLE (PART 2) Hex (VID7:VID0) Dec (VID7:VID0) 80 10000000 81 10000001 82 10000010 83 10000011 84 10000100 85 10000101 86 10000110 87 10000111 88 10001000 89 10001001 8A 10001010 8B 10001011 8C 10001100 8D 10001101 ...

Page 18

TABLE 4 - AMD 5-BIT TABLE FOR OPTERON VID4 Note: VID_SEL tied to LGND. V(VDAC) is pre-positioned 50mV higher than VID values listed above for load line positioning. VID is measured at EAOUT with EAOUT shorted to FB, ROSC=50 K ...

Page 19

IVSETPT Remote Sense Amplifier Figure 10 - Temperature compensation of inductor DCR Remote Voltage Sensing VOSEN+ and VOSEN- are used for remote sensing and connected directly to the load. The remote sense differential amplifier with high speed, low input offset ...

Page 20

Figure 11 depicts start-up sequence of converter with VR 11 VID with boot voltage, which is selected by VIDSEL pin based on Table 1. If there is no fault, the SS/DEL pin will start charging when the enable crosses the ...

Page 21

VCC (12V) ENABLE VID VDAC 4.0V 3.92V 1.4V SS/DEL EAOUT VOUT VRRDY START DELAY (TD1) Figure 12 - Start-up sequence of converter without boot voltage Constant Over-Current Control during Soft Start The over current limit threshold is set by a ...

Page 22

ENABLE INTERNAL OC DELAY 4.0V 3.92V 3.88V SS/DEL 1.1V EA VOUT VRRDY OCP THRESHOLD IOUT START-UP WITH OUTPUT SHORTED Figure 13 - Over Current Protection waveforms during and after soft start Linear Regulator Output (VCCL) The IR3500 has a built-in ...

Page 23

VCCL Under Voltage Lockout (UVLO) The IR3500 has no under voltage lockout for converter input voltage (VCC), but monitors the VCCL voltage instead, which is used for the gate drivers of phase ICs and circuits in control IC and phase ...

Page 24

IC, the OVP circuit overrides the normal PWM operation and will fully turn-on the low side MOSFET within approximately 150ns. The low side MOSFET will remain on until ISHARE pin voltage drops below V(VCCL) - 800mV, which signals the ...

Page 25

VCC VCCL+0.7V VCCL+0.7V VCCLDRV 1.8V OUTPUT VOLTAGE (VOSEN+) VCCL UVLO ROSC/OVP 1.6V Figure 16 - Over-voltage protection during power-up 12V VCC VCCL+0.7V VCCL+0.7V VCCLDRV 1.8V OUTPUT VOLTAGE (VOSEN+) 1.73V VCCL UVLO ROSC/OVP 1.6V Figure 17 - Over-voltage protection with ...

Page 26

VCC VCCL+0.7V VCCL+0.7V VCCLDRV OUTPUT 1.73V VOLTAGE (VOSEN+) VID + 0.13V VCCL UVLO VCCL - 1V ROSC/OVP 0.6V 3.92V (4V-0.08V) SS/DEL Figure 18 - Over-voltage protection with pre-charging converter output VID + 0.13V <Vo < 1.73V During dynamic VID ...

Page 27

VID (FAST VDAC) VDAC OV THRESHOLD OUTPUT VOLTAGE VDAC (VO) NORMAL OPERATION Figure 19 - Over-voltage protection during dynamic VID Open Daisy Chain Protection IR3500 checks the daisy chain every time it powers up. It starts a daisy chain pulse ...

Page 28

APPLICATIONS INFORMATION Q1 12V RVCCLDRV RVCCLFB1 RVCCLFB2 CVCCL 4.7uF VR READY VIDSEL VID7 1 24 VID7 LGND ROSC VID6 2 23 VID6 ROSC / OVP CSS/DEL VID5 3 22 VID5 SS/DEL IR3500 RVDAC VID4 4 21 VID4 VDAC CONTROL ROCSET ...

Page 29

Q1 12V ROVP1 RVCCLDRV RVCCLFB1 RVCCLFB2 CVCCL 4.7uF Q2 VR READY VIDSEL 1 24 VID7 VID7 LGND ROSC VID6 2 23 VID6 ROSC / OVP CSS/DEL 3 22 VID5 VID5 SS/DEL IR3500 RVDAC VID4 4 21 VID4 VDAC CONTROL ROCSET ...

Page 30

DESIGN PROCEDURE Oscillator Resistor Rosc The oscillator of IR500 generates square-wave pulses to synchronize the phase ICs. The switching frequency of each phase converter equals the PHSOUT frequency, which is set by the external resistor R curve in Figure 23. ...

Page 31

The soft start delay time (TD1) and VR ready delay time (TD3) are determined by (8) to (9) respectively Once C is chosen, the minimum over-current fault ...

Page 32

No Load Output Voltage Setting Resistor R A resistor between VSETPT pin and VDAC is used to create output voltage offset V difference between V voltage and output voltage at no load condition. R DAC I is the current flowing ...

Page 33

R R TMAX THERM Select the series resistor R HOTSET2 operational temperature range. Then calculate R TMAX from (23 HOTSET 1 VOLTAGE LOOP COMPENSATION The adaptive voltage positioning (AVP) is usually adopted in the computer applications to ...

Page 34

∗ ∗ optional and may be needed in some applications to ...

Page 35

∗ π ∗ ∗ π ∗ ∗ π ∗ ∗ ...

Page 36

The soft start delay time is − DEL − CHG The ...

Page 37

No Load Output Voltage Setting Resistor R From Figure 24, the bias current of VSETPT pin is 11.9uA with R − TOFST = = R VSETPT VSETPT VCCL ...

Page 38

2000 MAX DRP ∗ π ∗ ∗ ∗ ∗ ∗ ...

Page 39

The soft start time is − DEL = = = TD 2 − CHG The VID ...

Page 40

Calculate constant K the ratio of inductor peak current over average current in each phase, P,  ⋅ ⋅ − ⋅ ⋅ − ⋅ − ...

Page 41

VCCL TMAX HOTSET HOTSET VOLTAGE LOOP COMPENSATION Type III compensation is used for the converter with only ceramic output capacitors. The crossover frequency and phase margin ...

Page 42

Figure 23 - Frequency variation with ROSC. Figure 24 - ISETPT, OCSET with ROSC. Page IR3500 May 18, 2009 ...

Page 43

LAYOUT GUIDELINES The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB layout, therefore minimizing the noise coupled to the IC. • Dedicate at least one middle layer for a ground plane LGND. • ...

Page 44

PCB METAL AND COMPONENT PLACEMENT • Lead land width should be equal to nominal part lead width. The minimum lead to lead spacing should be ≥ 0.2mm to minimize shorting. • Lead land length should be equal to maximum part ...

Page 45

SOLDER RESIST • The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non ...

Page 46

STENCIL DESIGN • The stencil apertures for the lead lands should be approximately 80% of the area of the lead lands. Reducing the amount of solder deposited will minimize the occurrence of lead shorts. Since for 0.5mm pitch devices the ...

Page 47

PACKAGE INFORMATION 32L MLPQ ( Body) – θ IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 www.irf.com Page 24.4 C/W, θ =0. Data and ...

Related keywords