MCP1603-ADJI/MC Microchip Technology, MCP1603-ADJI/MC Datasheet - Page 11

• Manufacturer Part Number: MCP1603-ADJI/MC
• Description: IC SYNC BUCK REG .5A ADJ 8-DFN
• Manufacturer: Microchip Technology
• Type: Step-Down (Buck)r

Specifications of MCP1603-ADJI/MC

• Package / Case: 8-DFN
• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 4.5 V
• Current - Output: 500mA
• Frequency - Switching: 2MHz
• Voltage - Input: 2.7 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Output Voltage: 0.8 V to 4.5 V
• Output Current: 500 mA
• Input Voltage: 2.7 V to 5.5 V
• Switching Frequency: 2 MHz
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Duty Cycle (max): 100 %
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP1603RD-TNY - REFERENCE DESIGN FOR MCP1603MCP1603EV - BOARD EVAL BUCK CONV MCP1603
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.0
The descriptions of the pins are listed in
TABLE 3-1:
3.1
Connect the input voltage source to V
source must be decoupled to GND with a 4.7 µF
capacitor.
3.2
Ground pin for the device. The loop area of the ground
traces should be kept as minimal as possible.
3.3
The SHDN pin is a logic-level input used to enable or
disable the device. A logic high (> 45% of V
enable the regulator output. A logic-low (< 15% of V
will ensure that the regulator is disabled.
© 2007 Microchip Technology Inc.
MCP1603
TSOT23
—
—
1
2
3
4
5
PIN DESCRIPTIONS
Power Supply Input Voltage Pin
(V
Ground Pin (GND)
Shutdown Control Input Pin
(SHDN)
IN
)
MCP1603L
TSOT23
Pin No.
PIN FUNCTION TABLE
—
—
4
2
1
5
3
2x3 DFN
Exposed
2, 5, 6
Pad
7
8
3
4
1
Table
IN
V
. The input
Symbol
FB
SHDN
GND
V
NC
EP
L
3-1.
/V
IN
X
IN
OUT
) will
IN
)
Power Supply Input Voltage Pin
Ground Pin
Shutdown Control Input Pin
Feedback / Output Voltage Pin
Switch Node, Buck Inductor Connection Pin
No Connect
For the DFN package, the center exposed pad is a thermal
path to remove heat from the device. Electrically this pad is at
ground potential and should be connected to GND
3.4
For adjustable output options, connect the center of the
output voltage divider to the V
output voltage options, connect the output directly to
the V
3.5
Connect the L
pin carries large signal-level current; all connections
should be made as short as possible.
3.6
For the DFN package, connect the Exposed Pad to
GND, with vias into the GND plane. This connection to
the GND plane will aid in heat removal from the
package.
FB
/V
Feedback / Output Voltage Pin
(V
Switch Node, Buck Inductor
Connection Pin (L
Exposed Metal Pad (EP)
OUT
FB
pin.
X
/V
Description
pin directly to the buck inductor. This
OUT
)
MCP1603
FB
X
/V
)
OUT
DS22042A-page 11
pin. For fixed-