MCP1603-ADJI/MC Microchip Technology, MCP1603-ADJI/MC Datasheet - Page 6

• Manufacturer Part Number: MCP1603-ADJI/MC
• Description: IC SYNC BUCK REG .5A ADJ 8-DFN
• Manufacturer: Microchip Technology
• Type: Step-Down (Buck)r

Specifications of MCP1603-ADJI/MC

• Package / Case: 8-DFN
• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 4.5 V
• Current - Output: 500mA
• Frequency - Switching: 2MHz
• Voltage - Input: 2.7 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Output Voltage: 0.8 V to 4.5 V
• Output Current: 500 mA
• Input Voltage: 2.7 V to 5.5 V
• Switching Frequency: 2 MHz
• Operating Temperature Range: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Duty Cycle (max): 100 %
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP1603RD-TNY - REFERENCE DESIGN FOR MCP1603MCP1603EV - BOARD EVAL BUCK CONV MCP1603
• Power - Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP1603
TEMPERATURE SPECIFICATIONS
DS22042A-page 6
Electrical Specifications: Unless otherwise indicated, all limits are specified for: V
Temperature Ranges
Operating Junction Temperature
Range
Storage Temperature Range
Maximum Junction Temperature
Package Thermal Resistances
Thermal Resistance, 5L-TSOT
Thermal Resistance, 8L-2x3 DFN
Parameters
Sym
θ
θ
T
T
T
JA
JA
A
J
J
Min
-40
-65
—
—
—
84.5
Typ
256
—
—
—
+125
+150
+150
Max
—
—
Units
°C/W
°C/W
°C
°C
°C
IN
+ 2.7V to 5.5V
Steady State
Transient
Typical 4-layer Board with
Internal Ground Plane
Typical 4-layer Board with
Internal Ground Plane and
2-Vias in Thermal Pad
© 2007 Microchip Technology Inc.
Conditions