LTC3417AIFE#TRPBF Linear Technology, LTC3417AIFE#TRPBF Datasheet - Page 19

• Manufacturer Part Number: LTC3417AIFE#TRPBF
• Description: IC DC/DC CONV DUAL 20TSSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3417AIFE#TRPBF

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.8 ~ 5 V
• Current - Output: 1A, 1.5A
• Frequency - Switching: 1.5MHz, 0.6MHz ~ 4MHz
• Voltage - Input: 2.25 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

PACKAGE DESCRIPTION
3.50 ±0.05
2.20 ±0.05
1.65 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
6.60 ±0.10
(.0035 – .0079)
4.40 ±0.05
0.09 – 0.20
(2 SIDES)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4.50 ±0.10
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
RECOMMENDED SOLDER PAD LAYOUT
0.50 BSC
0.25 ± 0.05
(.169 – .177)
4.30 – 4.50*
(.020 – .030)
0.50 – 0.75
SEE NOTE 4
(.195)
MILLIMETERS
4.95
(INCHES)
(SEE NOTE 6)
0.65 ±0.05
TOP MARK
0.65 BSC
PACKAGE
OUTLINE
16-Lead Plastic DFN (5mm × 3mm)
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1706)
(Reference LTC DWG # 05-08-1663)
PIN 1
0.200 REF
0.45 ±0.05
Exposed Pad Variation CA
(.108)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
0.25
2.74
REF
1.05 ±0.10
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
PACKAGE OUTLINE MO-229
TOP AND BOTTOM OF PACKAGE
0° – 8°
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
4. RECOMMENDED MINIMUM PCB METAL SIZE
DHC Package
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FE Package
FOR EXPOSED PAD ATTACHMENT
5.00 ±0.10
(2 SIDES)
(.0256)
0.65
BSC
20 1918 17 16 15
1
(.0077 – .0118)
0.195 – 0.30
2
TYP
3 4 5 6 7 8 9 10
(.252 – .260)
6.40 – 6.60*
(.195)
3.00 ±0.10
0.75 ±0.05
4.95
(2 SIDES)
14 13
0.00 – 0.05
12
1.65 ± 0.10
(2 SIDES)
R = 0.20
11
FE20 (CA) TSSOP 0204
(.002 – .006)
0.05 – 0.15
TYP
(.108)
(.047)
2.74
MAX
1.20
(.252)
6.40
BSC
8
9
BOTTOM VIEW—EXPOSED PAD
4.40 ±0.10
(2 SIDES)
LTC3417A
R = 0.115
TYP
0.50 BSC
0.25 ± 0.05
16
1
0.40 ± 0.10
19
(DHC16) DFN 1103
PIN 1
NOTCH
3417afb