PC853XIJ000F Sharp Microelectronics, PC853XIJ000F Datasheet
PC853XIJ000F
Specifications of PC853XIJ000F
Related parts for PC853XIJ000F
PC853XIJ000F Summary of contents
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PC852XJ0000F Series PC853XJ0000F Series ■ Description PC852XJ0000F Series/PC853XJ0000F Series con- tains an IRED optically coupled to a phototransistor packaged in a 4-pin DIP, available in SMT gullw- ing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ● PC852XJ0000F Series 1. Through-Hole [ex. PC852XJ0000F] Anode mark Factory identification mark Date code ±0.5 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 ...
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... Epoxy resin ±0.1 0.26 θ θ θ 13˚ Product mass : approx. 0.23g PC852XJ0000F Series/PC853XJ0000F Series 2. SMT Gullwing Lead-Form [ex. PC853XIJ000F] Anode mark 1 2 ±0.5 4.58 +0.4 1.0 −0 ±0.1 0.5 Product mass : approx. 0.22g 3 (Unit : mm) Factory identification mark ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol PC852XJ0000F PC853XJ0000F Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation ...
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... Through-Hole Sleeve Package 100pcs/sleeve DIN EN60747-5-2 - Model No. PC853XJ0000F Please contact a local SHARP sales representative to inquire about production status. PC852XJ0000F Series/PC853XJ0000F Series SMT Gullwing Sleeve 100pcs/sleeve Approved - PC852XYJ000F PC852XIJ000F PC852XPJ000F SMT Gullwing Taping 2 000pcs/reel - - PC853XIJ000F PC853XPJ000F 6 Taping 2 000pcs/reel - Approved PC852XPYJ00F Sheet No.: D2-A04002EN ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3-a Collector Power Dissipation vs. Ambient Temperature (PC852XJ0000F) 200 150 100 50 0 − Ambient temperature T ...
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Fig.6 Forward Current vs. Forward Voltage T =75˚C a 50˚C 100 0.5 1.0 1.5 2.0 Forward voltage V Fig.7-b Current Transfer Ratio vs. Forward Current (PC853XJ0000F) 5 000 V = =25˚ 000 3 ...
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Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 1.2 1 0.8 0.6 0.4 0.2 0 − Ambient temperature T Fig.12 Response Time vs. Load Resistance 1 000 V = =20mA C T =25˚C a ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...
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Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 Reel structure and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...