PC364N1 Sharp Microelectronics, PC364N1 Datasheet
PC364N1
Specifications of PC364N1
Available stocks
Related parts for PC364N1
PC364N1 Summary of contents
Page 1
PC364N Series ■ Description PC364N Series contains an IRED optically coupled to a phototransistor. AC input and Low input current type packaged in a 4-pin mini-flat. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V (*) and CTR ...
Page 2
Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. SHARP mark "S" Primary side 3 64 mark 1 2 ±0.1 0.4 Epoxy resin Anode/Cathode 1 4 Cathode/Anode 2 Emitter 3 3 Collector 4 (Unit ...
Page 3
Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
Page 4
Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C Total power dissipation P ...
Page 5
... Model Line-up Taping Package 3 000 pcs / reel 750 pcs / reel PC364N PC364NT Model No. PC364N1 PC364N1T Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. I [mA] C Rank mark (I =±0.5mA, V =5V, T =25˚ mark 0.25 to 2.0 A 0.5 to 1.5 ...
Page 6
Fig.1 Test Circuit for Common Mode Rejection Voltae Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 200 150 100 ...
Page 7
Fig.6 Peak Forward Current vs. Duty Ratio 2 000 Pulse width≤100µs =25˚ 000 500 200 100 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current ...
Page 8
Fig.12 Collector Dark Current vs. Ambient Temperature −5 10 =50V V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...
Page 9
Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...
Page 10
Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
Page 11
Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
Page 12
Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
Page 13
Package materials 2. 750 pcs / reel Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ...
Page 14
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...