PC123F1J000F Sharp Microelectronics, PC123F1J000F Datasheet

PC123F1J000F

Manufacturer Part Number

PC123F1J000F

Description

PHOTOCOUPLER TRAN OUT WIDE 4-DIP

Manufacturer

Sharp Microelectronics

Datasheet

1.PC123ZY2J00F.pdf (16 pages)

Specifications of PC123F1J000F

Number Of Channels

Input Type

Voltage - Isolation

5000Vrms

Current Transfer Ratio (min)

50% @ 5mA

Current Transfer Ratio (max)

400% @ 5mA

Voltage - Output

70V

Current - Output / Channel

50mA

Current - Dc Forward (if)

10mA

Vce Saturation (max)

200mV

Output Type

Transistor

Mounting Type

Through Hole

Package / Case

4-DIP

Configuration

Maximum Collector Emitter Voltage

70 V

Maximum Collector Emitter Saturation Voltage

200 mV

Isolation Voltage

5000 Vrms

Current Transfer Ratio

400 %

Maximum Forward Diode Voltage

1.4 V

Maximum Collector Current

50 mA

Maximum Power Dissipation

200 mW

Maximum Operating Temperature

+ 100 C

Minimum Operating Temperature

- 30 C

Maximum Fall Time

18 us

Maximum Input Diode Current

50 mA

Maximum Reverse Diode Voltage

6 V

Maximum Rise Time

18 us

Output Device

Transistor

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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■ Description

■ Features

PC123J00000F

Series

coupled to a phototransistor.

spacing option and SMT gullwing lead-form option.

1. 4-pin DIP package

2. Double transfer mold package (Ideal for Flow Solder-

3. Current transfer ratio (CTR : MIN. 50% at I

4. Several CTR ranks available

5. Reinforced insulation type (Isolation distance : MIN.

6. Long creepage distance type (wide lead-form type

7. High isolation voltage between input and output

8. Lead-free and RoHS directive compliant

Notice The content of data sheet is subject to change without prior notice.

PC123J00000F Series contains an IRED optically

It is packaged in a 4-pin DIP, available in wide-lead

Input-output isolation voltage(rms) is 5.0kV.

CTR is 50% to 400% at input current of 5mA.

ing)

0.4mm)

only : MIN. 8mm)

iso(rms)

=5V)

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

: 5.0 kV)

=5 mA,

■ Agency approvals/Compliance

■ Applications

DIP 4pin Reinforced Insulation Type

Photocoupler

1. Recognized by UL1577 (Double protection isolation),

2. Approved by BSI, BS-EN60065, file No. 7087, BS-

3. Approved by SEMKO, EN60065, EN60950, (as mod-

4. Approved by DEMKO, EN60065, EN60950 (as mod-

5. Approved by NEMKO, EN60065, EN60950, (as mod-

6. Approved by FIMKO, EN60065, EN60950, (as mod-

7. Recognized by CSA file No. CA95323 (as model No.

8. Approved by VDE (DIN EN60747-5-2

9. Package resin : UL flammability grade (94V - 0)

1. I/O isolation for MCUs (Micro Controller Units)

2. Noise suppression in switching circuits

3. Signal transmission between circuits of different po-

4. Over voltage detection

file No. E64380 (as model No. PC123)

EN60950 file No. 7409, (as model No. PC123)

el No. PC123)

PC123)

tion), file No. 40008087 (as model No. PC123)

(∗)

tentials and impedances

DIN EN60747-5-2 : successor standard of DIN VDE0884

PC123J00000F Series

Sheet No.: D2-A02904EN

(∗)

Date Sep. 1. 2006

) (as an op-

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PC123F1J000F Summary of contents

Page 1

PC123J00000F Series ■ Description PC123J00000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to ...

Page 2

Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC123J00000F] Rank mark Anode mark Factory identification mark Date code 1 4 PC123 2 3 ±0.3 6.5 ±0.30 7.62 Epoxy resin ±0.10 0.26 θ θ θ ...

Page 3

SMT Gullwing Lead-Form [ex. PC123PJ0000F] Rank mark Factory identification mark Anode mark Date code ±0.3 6.5 ±0.30 7.62 Epoxy resin +0.4 +0.4 1.0 1.0 −0.0 −0.0 +0.0 10.0 −0.5 Product ...

Page 4

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 5

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...

Page 6

... PC123P5J000F PC123PY5J00F PC123PSJ000F PC123PY8J00F Please contact a local SHARP sales representative to inquire about production status. Wide Through-Hole Sleeve 100pcs/sleeve Approved −−−−−− PC123FJ0000F PC123FYJ000F PC123F1J000F PC123FY1J00F PC123F2J000F PC123FY2J00F PC123F5J000F PC123FY5J00F PC123FSJ000F PC123FY8J00F Wide SMT Gullwing Taping 2 000pcs/reel Approved − ...

Page 7

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...

Page 8

Fig.7 Current Transfer Ratio vs. Forward Current 300 250 200 150 100 50 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature T Fig.11 ...

Page 9

Fig.13 Test Circuit for Response Time Input V CC Output Output R Input Please refer to the conditions in Fig.12. Fig.15 Collector-emitter Saturation Voltage vs. Forward Current 5.0 I =0.5mA C 1mA 4.5 ...

Page 10

Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...

Page 11

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 12

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...

Page 13

Package specification ● Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless ...

Page 14

Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.40 ...

Page 15

Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.40 Reel structure and Dimensions e ...

Page 16

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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