PC3H411NIP0F Sharp Microelectronics, PC3H411NIP0F Datasheet
PC3H411NIP0F
Specifications of PC3H411NIP0F
Related parts for PC3H411NIP0F
PC3H411NIP0F Summary of contents
Page 1
PC3H41xNIP0F Series ∗ 4-channel package type is also available. (model No. PC3Q410NIP0F) ■ Description PC3H41xNIP0F Series contains a IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat, half pitch type. Input-output isolation voltage(rms) is 2.5kV. Collector-emitter ...
Page 2
Internal Connection Diagram 1 2 ■ Outline Dimensions Rank mark Date code SHARP mark "S" Primary side mark ±0.2 4.4 ±0.3 5.3 (1.7) +0.4 0.5 −0.2 +0.2 7.0 −0 ...
Page 3
Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
Page 4
Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C Total power dissipation P ...
Page 5
... Model Line-up Taping Package 3 000pcs/reel PC3H410NIP0F with or without Model No. PC3H411NIP0F Please contact a local SHARP sales representative to inquire about production status. I [mA] C Rank mark (I =±0.5mA, V =5V 0.25 to 2.0 A 0.5 to 1.5 5 PC3H41xNIP0F Series =25˚C) Sheet No.: D2-A02102EN ...
Page 6
Fig.1 Test Circuit for Common Mode Rejection Voltage Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 250 200 ...
Page 7
Fig.6 Peak Forward Current vs. Duty Ratio Pulse width≤100µ 000 100 10 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current 600 500 400 300 200 100 0 0.1 1 Forward current I ...
Page 8
Fig.12 Collector Dark Current vs. Ambient Temperature − =50V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...
Page 9
Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...
Page 10
Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
Page 11
Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
Page 12
Package specification ● Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 12.0 H ±0.1 7.5 0.3 Reel ...
Page 13
Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...