TLP181(GB-TPR,F,T) Toshiba, TLP181(GB-TPR,F,T) Datasheet - Page 7

PHOTOCOUPLER TRANS OUT 4-SMD

TLP181(GB-TPR,F,T)

Manufacturer Part Number
TLP181(GB-TPR,F,T)
Description
PHOTOCOUPLER TRANS OUT 4-SMD
Manufacturer
Toshiba
Datasheets

Specifications of TLP181(GB-TPR,F,T)

Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
100% @ 5mA
Current Transfer Ratio (max)
600% @ 5mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-SMD
Output Device
Transistor
Number Of Elements
1
Reverse Breakdown Voltage
5V
Forward Voltage
1.3V
Forward Current
50mA
Collector-emitter Voltage
80V
Package Type
MFSOP
Collector Current (dc) (max)
50mA
Isolation Voltage
3750Vrms
Power Dissipation
200mW
Collector-emitter Saturation Voltage
0.4V
Current Transfer Ratio
600%
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-25C to 85C
Operating Temperature Classification
Commercial
Maximum Collector Emitter Voltage
80 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
10 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Maximum Fall Time
3 us
Maximum Input Diode Current
50 mA
Maximum Reverse Diode Voltage
5 V
Maximum Rise Time
2 us
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP181(GB-TPR)
TLP181GBFTR
TLP181GBTPR
TLP181GBTPRFT
TLP181GBTR
TLP181GBTR
There is a strong market need for smaller photorelays.
To meet this need, Toshiba has developed photorelays
in the ultra-small USOP4 package, which are suitable
for high-density board assembly. These photorelays
help to reduce system size and cost. They are ideal
for use in small measuring instruments such as
semiconductor testers that require numerous relays.
The TLP3312 and TLP3375 provide well-balanced
off-state voltage and on-state current, making them
suitable not only for tester applications but also for
various applications requiring high-density board
assembly such as battery-controlled devices.
Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current.
Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc
current respectively. They are suitable for various applications such as factory equipment, power supplies and security systems.
*Under development. Specifications subject to change without notice.
For the latest information, please contact your nearest Toshiba sales representative.
Photorelays in the Ultra-Small USOP4 Package: TLP33xx Series
High-ION Photorelays: TLP354x Series (Under Development)
Package
Peak Off-State Voltage
(min)
On-State Current
(max)
On-State Resistance
(max)
Isolation Voltage
(min)
Part Number
TLP3312
TLP3375
Characteristic
Off-State Voltage
(max)
60 V
50 V
Symbol
V
R
B
I
OFF
ON
ON
VS
On-State Current
Vrms
Unit
V
A
(max)
0.4 A
0.3 A
Available
TLP3542
2500
Resistance (max)
100
2.5
40
On-State
1.5 Ω
1.5 Ω
Total Capacitance
TLP3543
1.65
2500
7
20
50
4
(typ.)
20 pF
12 pF
Current (max)
LED Trigger
TLP3544
3 mA
3 mA
2500
DIP6
USOP4
3.5
40
60
Under Development
Pin Configuration
TLP3545
SSOP4
1
2
2500
60
70
3
Scheduled for mass production in April
USOP4
4
3
TLP3546
2500
100
200
2
1. Anode
2. Cathode
3. Drain
4. Drain

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