TLP181(GB,F,T) Toshiba, TLP181(GB,F,T) Datasheet - Page 21

• Manufacturer Part Number: TLP181(GB,F,T)
• Description: PHOTOCOUPLER TRANS-OUT 4-SMD
• Manufacturer: Toshiba

Specifications of TLP181(GB,F,T)

• Number Of Channels: 1
• Input Type: DC
• Voltage - Isolation: 3750Vrms
• Current Transfer Ratio (min): 100% @ 5mA
• Current Transfer Ratio (max): 600% @ 5mA
• Voltage - Output: 80V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 400mV
• Output Type: Transistor
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Configuration: 1 Channel
• Maximum Collector Emitter Voltage: 80 V
• Maximum Collector Emitter Saturation Voltage: 0.4 V
• Isolation Voltage: 3750 Vrms
• Current Transfer Ratio: 100 % to 600 %
• Maximum Forward Diode Voltage: 1.3 V
• Minimum Forward Diode Voltage: 1 V
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• Forward Current: 10 mA
• Maximum Input Diode Current: 10 mA
• Output Device: Phototransistor
• Number Of Elements: 1
• Reverse Breakdown Voltage: 5V
• Forward Voltage: 1.3V
• Collector-emitter Voltage: 80V
• Package Type: MFSOP
• Collector Current (dc) (max): 50mA
• Power Dissipation: 200mW
• Collector-emitter Saturation Voltage: 0.4V
• Pin Count: 4
• Mounting: Surface Mount
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP181GBF

Photocouplers for Logic Signal Transmission at 5 Mbit/s (Typ.) (Continued)
Photocouplers for Logic Signal Transmission at 1 Mbit/s (Typ.)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
TLP2105
TLP2108
TLP2200
TLP109
TLP2409
TLP512
TLP550
TLP551
TLP2403
TLP553
TLP559
TLP651
TLP719
TLP719F
Part Number
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
Pin Configuration
Pin Configuration
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
8
1
6
1
6
1
6
1
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
7
2
5
5
2
5
2
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
6
3
: Design which meets safety standard/approval pending as of January 2011
4
3
3
4
4
3
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
SO6 (reinforced insulation)
SO8
Topr = 125˚C(max)
SO8 version of the TLP109
DIP6
6-pin package version
of the TLP550
DIP8
High CMR
DIP8
Internal base connection
SO8
Low input current
SO8 version of the TLP553
DIP8
Low input drive current
DIP8
High CMR version
of the TLP550
DIP8
Internal base connection
SDIP6
High CMR
SO8
Dual-channel version for
the TLP105
V
SO8
Dual-channel version for
the TLP108
V
DIP8
Low input current
V
CC
CC
CC
= 4.5 to 20 V
= 4.5 to 20 V
= 4.5 to 20 V
Features
Features
: Approved (reinforced insulation)
(NRZ) (Typ.)
Propagation
Delay Time
Data Rate
300 kbit/s
300 kbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
1 Mbit/s
250 ns
250 ns
400 ns
(Max)
21
(19% min for rank 0)
(19% min for rank 0)
(19% min for rank 0)
(Inverter logic)
(Buffer logic)
(Buffer logic)
Output Form
Totem pole
Totem pole
400%
400%
20% (min)
20%
20%
20%
10%
10%
10%
20%
3-state
output
output
CTR
: Design which meets safety standard/approval pending as of January 2011
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
(min)
1.6 mA
1.6 mA
1.6 mA
0.5 mA
16 mA
16 mA
0.5 mA
16 mA
16 mA
16 mA
16 mA
16 mA
16 mA
(Max)
I
I
@I
FHL
FLH
F
,
Vrms
Vrms
Vrms
Vrms
Vrms
3750
3750
2500
3750
Vrms
3750
2500
Vrms
2500
Vrms
2500
Vrms
3750
2500
Vrms
2500
Vrms
5000
Vrms
5000
Vrms
BVs
BVs
UL/cUL TÜV
UL/cUL TÜV
/
/
/
/
/
/
/
/
/
/
/ –
/
/ –
Safety Standards
Safety Standards
VDE
VDE
(1)
(1)
(1)
(1)
(1)
BSI
BSI
(2)
(2)
IEC
IEC