TLP137(F) Toshiba, TLP137(F) Datasheet - Page 13

• Manufacturer Part Number: TLP137(F)
• Description: PHOTOCOUPLER TRANS-OUT 5-SMD
• Manufacturer: Toshiba

Specifications of TLP137(F)

• Number Of Channels: 1
• Input Type: AC, DC
• Voltage - Isolation: 3750Vrms
• Current Transfer Ratio (min): 100% @ 1mA
• Current Transfer Ratio (max): 1200% @ 1mA
• Voltage - Output: 80V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 400mV
• Output Type: Transistor with Base
• Mounting Type: Surface Mount
• Package / Case: 5-SMD
• Configuration: 1
• Maximum Collector Emitter Voltage: 80 V
• Maximum Collector Emitter Saturation Voltage: 200 mV (Typ)
• Isolation Voltage: 3750 Vrms
• Current Transfer Ratio: 1200 %
• Maximum Forward Diode Voltage: 1.3 V
• Minimum Forward Diode Voltage: 1 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 55 C
• Maximum Input Diode Current: 50 mA
• Maximum Reverse Diode Voltage: 5 V
• Output Device: Transistor With Base
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP137F

General-Purpose, Transistor-Output Photocouplers (Continued)
Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages.
Note 2: BSI and IEC: : Approved (supplementary or basic insulation)
Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative.
TLP628-2
TLP628-4
TLP629
TLP629-2
TLP629-4
TLP631
TLP632
TLP731
TLP732
TLP733
TLP733F
Part Number
Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details.
TÜV and VDE: : Approved
For the latest information, please contact your nearest Toshiba sales representative.
EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved
EN 60747-5-2-approved with option V4 or D4
16
16
1
1
Pin Configuration
8
1
8
1
15
15
2
2
6
1
6
1
6
1
6
1
6
1
14
14
3
3
4
1
7
2
7
2
13
13
4
4
5
2
5
2
5
2
5
2
5
2
12
12
5
5
6
3
6
3
3
2
: Design which meets safety standard/approval pending as of January 2011
11
11
6
6
4
3
4
3
4
3
4
3
4
3
10
10
7
7
5
4
5
4
9
8
9
8
DIP8
Dual-channel version
of the TLP628
DIP16
4-channel version of
the TLP628
DIP4
High input current
I
DIP8
Dual-channel version
of the TLP629
DIP16
4-channel version of
the TLP629
DIP6
Internal base
connection
DIP6
High EMI immunity
DIP6
SEMKO-approved
Internal base
connection
DIP6
SEMKO-approved
DIP6
SEMKO-approved
Internal base
connection
F
=
150 mA
Features
: Approved (reinforced insulation)
Rank
GB
GR
GB
GR
GB
GR
GB
GR
GB
GR
GB
GB
–
–
–
–
–
–
–
–
–
–
13
100
100
100
100
100
100
100
100
Min
100
100
100
100
50
50
50
50
50
20
20
20
50
50
CTR (%)
Max
600
600
600
600
600
600
300
600
600
300
600
600
300
600
600
300
600
600
300
80
80
80
(3)
@I
: Design which meets safety standard/approval pending as of January 2011
100 mA,
100 mA,
100 mA,
5 mA,
5 mA,
5 mA,
5 mA,
5 mA,
5 mA,
5 mA,
F
5 V
5 V
1 V
1 V
1 V
5 V
5 V
5 V
5 V
5 V
, V
CE
350 V
350 V
V
55 V
55 V
55 V
55 V
55 V
55 V
55 V
55 V
CEO
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
Vrms
5000
5000
5000
5000
5000
5000
5000
4000
4000
4000
BVs
UL/
/
/
/
/
C
/ –
/ –
/ –
/ –
/ –
/ –
UL
TÜV
Safety Standards
VDE
BSI
(2)
IEC