PC844X1 Sharp Microelectronics, PC844X1 Datasheet

PHOTOCOUPLER 4CH OUT 16-DIP

PC844X1

Manufacturer Part Number
PC844X1
Description
PHOTOCOUPLER 4CH OUT 16-DIP
Manufacturer
Sharp Microelectronics
Datasheet

Specifications of PC844X1

Number Of Channels
4
Input Type
AC, DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
20% @ 1mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
±50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
16-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current Transfer Ratio (max)
-
Other names
425-1495-5
■ Description
■ Features
PC844X Series
to a phototransistor.
to 300% at input current of ±1mA.
1. 16pin DIP 4-channel package
2. Double transfer mold package (ldeal for Flow Solder-
3. AC input type
4. High collector-emitter voltage (V
5. Current transfer ratio
6. High isolation voltage between input and output
1-channel package type is also available.
(model No. PC814X Series)
Notice The content of data sheet is subject to change without prior notice.
(*) Up to Date code "P7" (July 2002) V
PC844X Series contains an IRED optically coupled
It is packaged in a 4-channel 16pin DIP.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V
ing)
(CTR : MIN. 20% at I
(V
iso(rms)
From the production Date code "J5" (May 1997) to "P7" (July
2002), however the products were screened by BV
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
: 5.0kV)
F
=±1mA, V
CEO
CE
CEO
(*)
: 35V.
=5V)
and CTR is 20%
: 80V
(*)
CEO
)
≥70V.
1
■ Agency approvals/Compliance
■ Applications
DIP 16pin (4-channel)
AC Input Photocoupler
1. Recognized by UL1577, file No. E64380 (as model
2. Package resin : UL flammability grade
1. Programmable controllers
2. Telephone sets, telephone exchangers
3. System appliances
4. Signal tranmission between circuits of different poten-
No. PC844)
(94V-0)
tials and impedances
PC844X Series
Sheet No.: D2-A03602EN
© SHARP Corporation
Date Mar. 26. 2004

Related parts for PC844X1

PC844X1 Summary of contents

Page 1

PC844X Series ∗ 1-channel package type is also available. (model No. PC814X Series) ■ Description PC844X Series contains an IRED optically coupled to a phototransistor packaged in a 4-channel 16pin DIP. Input-output isolation voltage(rms) is 5.0kV. (*) Collector-emitter ...

Page 2

Internal Connection Diagram ■ Outline Dimensions ±0.3 1.2 ±0.2 0 PC844 ±0.25 2.54 Date code Rank mark ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...

Page 5

... PC844X Model No. PC844X1 A Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. I [mA =± ...

Page 6

Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...

Page 7

Fig.7 Current Transfer Ratio vs. Forward Current 140 120 100 0.1 0.2 0 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − ...

Page 8

Fig.13 Response Time vs. Load Resistance 500 V = =2mA 200 C T =25˚C a 100 0.5 0.2 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response ...

Page 9

Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...

Page 10

Manufacturing Guidelines ● Soldering Method Flow Soldering : Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270˚C and within 10s. Preheating is ...

Page 11

Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...

Page 12

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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