PC847X7 Sharp Microelectronics, PC847X7 Datasheet
PC847X7
Specifications of PC847X7
Related parts for PC847X7
PC847X7 Summary of contents
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PC847X Series ∗ 1-channel package type is also available. (model No. PC817X Series) ■ Description PC847X Series contains an IRED optically coupled to a phototransistor packaged in a 4-channel package, available in SMT gullwing lead-form option. Input-output isolation ...
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Internal Connection Diagram ■ Outline Dimensions 1. Through-Hole [ex. PC847X] ±0.3 1.2 ±0.2 0 ±0.25 2.54 19.82 2. SMT Gullwing Lead-Form ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Lead Form Through-Hole Sleeve Package 25pcs/sleeve PC847X PC847X5 PC847X6 Model No. PC847X7 PC847X8 PC847X9 PC847X0 Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. SMT Gullwing I [mA =5mA, V =5V, T =25˚ PC847XI 2.5 to 30.0 PC847XI5 4 ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Forward Current vs. Forward Voltage 500 T =75˚C a 200 50˚C 100 0.5 1.0 1.5 2.0 Forward voltage V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150% I =1mA ...
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Fig.13 Response Time vs. Load Resistance 500 V = =2mA 200 C T =25˚C a 100 0.5 0.2 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...