TLP130 Toshiba, TLP130 Datasheet - Page 42

• Manufacturer Part Number: TLP130
• Description: PHOTOCPLR AC-IN TRANS-OUT 5-SMD
• Manufacturer: Toshiba

Specifications of TLP130

• Number Of Channels: 1
• Input Type: AC, DC
• Voltage - Isolation: 3750Vrms
• Current Transfer Ratio (min): 50% @ 5mA
• Current Transfer Ratio (max): 600% @ 5mA
• Voltage - Output: 80V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 400mV
• Output Type: Transistor with Base
• Mounting Type: Surface Mount
• Package / Case: 5-SMD
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

6
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Example 1: Standard part: TLP620(F)
1
Package Information
Lead Form Options for DIP Packages
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
Carrier Tape Code
Package Outlines
Lead Form Code
See the TLP781, TLP785 datasheet.
Appearance
Lead Form
6-pin DIP
4-pin DIP
6
1 2
Dimensions
All other package dimensions are the same as for each standard package
specification.
Dimension
4 3
1
5
2
(TP1)
(LF1)
4
3
A
B
C
Version
16
1
8
1
Min
6.4
16-pin DIP
8-pin DIP
–
(0.35 typ.)
(LF1)
42
Surface-Mount
Max
10.0
5
–
4
(TP4)
(LF4)
9
8
Min
8.0
–
(0.25 typ.)
B
(LF4)
Max
12.0
–
Min
6.4
–
–
* Tape-and-reel packing is not available with (LF2).
(LF5)
(TP5)
A
C
(LF5)
Unit: mm
Max
10.0
0.2
–
Not available*
Wide-Spaced
10 to 12
(LF2)
10.16