PC4SD21YXPDF Sharp Microelectronics, PC4SD21YXPDF Datasheet - Page 4

PHOTOTRIAC COUPLER 800V GW 6-SMD

PC4SD21YXPDF

Manufacturer Part Number
PC4SD21YXPDF
Description
PHOTOTRIAC COUPLER 800V GW 6-SMD
Manufacturer
Sharp Microelectronics
Datasheets

Specifications of PC4SD21YXPDF

Voltage - Isolation
5000Vrms
Number Of Channels
1
Voltage - Off State
800V
Output Type
AC, Triac, Zero Cross
Current - Gate Trigger (igt) (max)
3mA
Current - Hold (ih)
100µA
Current - Dc Forward (if)
50mA
Current - Output / Channel
100mA
Mounting Type
Surface Mount
Package / Case
6-SMD
No. Of Channels
1
Input Current
20mA
Output Voltage
800V
Opto Case Style
SMD
No. Of Pins
6
Approval Bodies
CSA
Approval Category
UL Recognised
External Depth
7.62mm
External Length /
RoHS Compliant
Isolation Voltage
5kV
Optocoupler Output Type
Phototriac
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
425-2658-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PC4SD21YXPDF
Manufacturer:
ST
Quantity:
5 996
Phototriaccoupler : Lead-free part soldering conditions
DIP4pin(SMD) / DIP6pin(SMD)
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Soldering Method
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
3
Reflow
220˚C or more, 60s or less
4
(min)
2004. Dec

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