HFCT-5914ATLZ Avago Technologies US Inc., HFCT-5914ATLZ Datasheet - Page 4

• Manufacturer Part Number: HFCT-5914ATLZ
• Description: TXRX SMF LC 1.25GBD 2X10 EXT TMP
• Manufacturer: Avago Technologies US Inc.

Specifications of HFCT-5914ATLZ

• Data Rate: 1.25Gbps
• Wavelength: 1310nm
• Applications: Ethernet
• Voltage - Supply: 3.1 V ~ 3.5 V
• Connector Type: LC Duplex
• Mounting Type: Through Hole
• Supply Voltage: 3.3V
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package
The overall package concept for the device consists of
the following basic elements; two optical subassem-
blies, two electrical subassemblies and the housing as
illustrated in the block diagram in Figure 3.
The package outline drawing and pin out are shown in
Figures 4 and 5. The details of this package outline and
pin out are compliant with the multisource definition of
the 2 x 10 DIP.
The electrical subassemblies consist of high volume
multilayer printed circuit boards on which the IC and
various surface-mounted passive circuit elements are
attached.
The receiver electrical subassembly includes an internal
shield for the electrical and optical subassembly to en-
sure high immunity to external EMI fields.
The optical subassemblies are each attached to their
respective transmit or receive electrical subassemblies.
These two units are then placed within the outer hous-
ing of the transceiver. The outer housing of the trans-
Figure 3. Block Diagram
4
DATA IN
DATA IN
Tx DISABLE
B
B
P
P
PHOTO DETECTOR
DATA OUT
DATA OUT
SIGNAL
MON
MON
MON
MON
BIAS
DETECT
(+)
(-)
(+)
(-)
* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR IMPROVED EMI PERFORMANCE.
AND CONTROL
LASER DRIVER
T
X
CIRCUIT
GROUND
QUANTIZER IC
R
T
X
X
SUPPLY
SUPPLY
R
OUTPUT POWER
X
MONITORING
MONITORING
LASER DIODE
LASER BIAS
GROUND
ceiver is molded with nonconductive plastic to provide
mechanical strength. The housing is then encased with
a metal EMI protective shield. The case is signal ground
and we recommend soldering the four ground tabs to
host card signal ground.
Each electrical subassembly PCB carries the signal pins
that exit from the bottom of the transceiver.
The solder posts are fastened into the molding of the
device. This design provides the mechanical strength
required to withstand the additional stresses on the
transceiver resulting from the insertion force of fiber
cable mating. Although the solder posts are not con-
nected electrically to the transceiver, it is recommended
that they are connected to the chassis ground.
CASE
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
*
LC
RECEPTACLE