HFBR-1523Z Avago Technologies US Inc., HFBR-1523Z Datasheet - Page 4

• Manufacturer Part Number: HFBR-1523Z
• Description: XMITTER FIBER OPTIC 600NM 40KBD
• Manufacturer: Avago Technologies US Inc.

Specifications of HFBR-1523Z

• Wavelength: 660nm
• Voltage - Forward (vf) Typ: 2.02V
• Current - Dc Forward (if): 60mA
• Voltage - Dc Reverse (vr) (max): 5V
• Capacitance: 86pF
• Connector Type: Versatile Link
• Function: Ideal for solving problems with voltage isolation/insulation, EMI/RFI immunity or data security.
• Product: Transmitter
• Data Rate: 5 MBd
• Diode Capacitance: 86 pF
• Maximum Rise Time: 80 ns (Typ)
• Maximum Fall Time: 40 ns (Typ)
• Pulse Width Distortion: 30 ns
• Maximum Output Current: 5.1 mA
• Operating Supply Voltage: 7 VDC
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Data Rate Max: 495Mbps
• Forward Current If: 80mA
• Forward Voltage: 1.67V
• Reverse Voltage Vr: 5V
• Data Transmission Distance: 120ft
• Wavelength Typ: 660nm
• Msl: MSL 4 - 72 Hours
• Fiber Material: Plastic
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Spectral Bandwidth: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With: Plastic Optical Fiber
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-2045

Versatile Link Printed Board Layout Dimensions
Horizontal Module
Interlocked (Stacked) Assemblies
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter -
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This tech nique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
Stacking Horizontal Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages
4
TOP VIEW
(0.100)
2.54
DIMENSIONS IN MILLIMETERS (INCHES).
4
5
3 2
1
8
(0.300)
7.62
(0.073)
1.85
1.01 (0.040) DIA.
(0.300)
MIN.
7.62
(refer to Figure 1)
PCB EDGE
Vertical Module
packages can be disengaged if necessary. Repeated
stacking and unstack ing causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Vertical Modules