TLBD1060(T18) Toshiba, TLBD1060(T18) Datasheet - Page 5

• Manufacturer Part Number: TLBD1060(T18)
• Description: LED BLUE CLR 470NM MINI PLCC SMD
• Manufacturer: Toshiba

Specifications of TLBD1060(T18)

• Color: Blue
• Millicandela Rating: 60mcd
• Current - Test: 20mA
• Wavelength - Dominant: 470nm
• Wavelength - Peak: 468nm
• Voltage - Forward (vf) Typ: 3.3V
• Lens Type: Clear
• Lens Style/size: Rectangle, 2.2mm x 1.4mm
• Package / Case: 2-Mini PLCC
• Size / Dimension: 2.20mm L x 1.40mm W
• Height: 1.30mm
• Viewing Angle: 120°
• Mounting Type: Surface Mount
• Resistance Tolerance: 470nm
• Led Size: 2.2 mm x 1.4 mm
• Illumination Color: Blue
• Operating Voltage: 3.3 V
• Wavelength: 470 nm
• Luminous Intensity: 60 mcd
• Mounting Style: SMD/SMT
• Operating Current: 20 mA
• Lens Shape: Rectangular
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: TLBD1060(T18); TLBD1060T18TR

Packaging
These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid
moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air
before soldering and they should therefore be stored under the following conditions:
Mounting Method
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1. This moisture proof bag may be stored unopened within 12 months at the following conditions.
2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of
3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to
4. Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting.
5. If the packing material of laminate would be broken, the hermeticity would deteriorate. Therefore, do not
Soldering
Reflow soldering
The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the
condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under
the above conditions.
Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of
opening the package.
Second reflow soldering
In case of second reflow soldering should be performed within 168 h of the first reflow under the above
conditions.
Storage conditions before the second reflow soldering: 30°C, 60% RH (max)
Make any necessary soldering corrections manually.
(only once at each soldering point)
Do not perform wave soldering.
Recommended Soldering Pattern
Temperature: 5°C to 30°C
Humidity: 90% (max)
5°C to 30°C/60% RH or below.
pink) or the expiration date has passed, the devices should be baked in taping with reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60±5°C, for 12 to 24 hours.
Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed.
Furthermore, prevent the devices from being destructed against static electricity for baking of it.
throw or drop the packed devices.
Soldering iron: 25 W
Temperature: 300°C or less
Time:
Temperature profile for Pb soldering (example)
4°C/s max
within 3 s
(*)
240°C max
140 to 160°C
60 to 120 s
Time (s)
0.8
(*)
max
10 s max
max
4°C/s max
1.2
(*)
(*)
0.8
(*)
(*)
1.0
5
Temperature profile for Pb-free soldering (example)
Unit: mm
4°C/s max
150 to 180°C
max
260°C max
(*)
4°C/s max
(*)
60 to 120 s
TL(BD,EGD)1060(T18)
230°C
Time (s)
(*)
(*)
30 to 50 s max
5 s max
max
(*)
(*)
2008-08-05
(*)