HLMP-D401 Avago Technologies US Inc., HLMP-D401 Datasheet - Page 11

• Manufacturer Part Number: HLMP-D401
• Description: LED 5MM 600NM ORANGE DIFF
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HLMP-D401

• Viewing Angle: 60°
• Package / Case: Radial - 2 Lead
• Color: Orange
• Millicandela Rating: 5.4mcd
• Current - Test: 10mA
• Wavelength - Dominant: 602nm
• Wavelength - Peak: 600nm
• Voltage - Forward (vf) Typ: 1.9V
• Lens Type: Diffused, Orange Tinted
• Lens Style/size: Round, 5mm, T-1 3/4
• Height: 8.81mm
• Mounting Type: Through Hole
• Resistance Tolerance: 602nm
• Led Size: T-1 3/4
• Illumination Color: Orange
• Lens Color/style: Tinted Diffused
• Operating Voltage: 1.9 V
• Wavelength: 602 nm
• Luminous Intensity: 5.4 mcd
• Operating Current: 10 mA
• Lens Dimensions: 5 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Color, Emitted: Orange
• Current, Forward: 90 mA
• Diameter: 3 mm
• Finish, Lens: Diffused
• Package Type: 3 mm (T-1)
• Temperature, Operating, Maximum: +100 °C
• Temperature, Operating, Minimum: -55 °C
• Temperature, Soldering: +260 °C
• Voltage, Forward: 2 V
• Voltage, Reverse: 5 V
• Wavelength, Peak: 583 nm
• Emitting Color: Orange
• Test Current (it): 10mA
• Forward Current: 25mA
• Dominant Wave Length: 602nm
• Forward Voltage: 2.4V
• Product Length (mm): 6.1mm
• Product Height (mm): 9.19mm
• Product Depth (mm): 6.1mm
• Mounting: Through Hole
• Peak Wavelength: 600nm
• Shape Type: Circular
• Chip Material: GaP
• Main Category: Standard LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 5V
• Power Dissipation: 85mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1330

Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must be
• It is recommended that tooling made to precisely form
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• The closest LED is allowed to solder on board is 1.59
• Recommended soldering conditions:
For product information and a complete list of distributors, please go to our website:
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4258EN
AV02-1558EN - October 13, 2008
length prior to insertion and soldering into PC board.
taken to avoid any excessive mechanical stress induced
to LED package. Otherwise, cut the leads of LED to length
after soldering process at room temperature. The solder
joint formed will absorb the mechanical stress of the
lead cutting from traveling to the LED chip die attach
and wirebond.
and cut the leads to length rather than rely upon hand
operation.
process to prevent damage to LED component.
mm below the body (encapsulant epoxy) for those parts
without standoff.
Pre-heat Temperature 105 °C Max.
Pre-heat Time
Peak Temperature
Dwell Time
Figure 17. Recommended wave soldering profile
250
200
150
100
50
30
0
10
FLUXING
TURBULENT WAVE
PREHEAT
20
30
TIME – SECONDS
40
Wave Soldering
30 sec Max.
250 °C Max.
3 sec Max.
50
60
70
LAMINAR WAVE
HOT AIR KNIFE
80
Manual Solder
Dipping
–
–
260 °C Max.
5 sec Max.
90
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
www.avagotech.com
• Wave soldering parameter must be set and maintained
• If necessary, use fixture to hold the LED component
• Proper handling is imperative to avoid excessive thermal
• Special attention must be given to board fabrication,
• Recommended PC board plated through hole sizes for
according to recommended temperature and dwell time
in the solder wave. Customer is advised to periodically
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
in proper orientation with respect to the PCB during
soldering process.
stresses to LED components when heated. Therefore,
the soldered PCB must be allowed to cool to room
temperature, 25°C, before handling.
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
LED component leads:
Note:
soldering LED components.
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Refer to application note AN1027 for more information on
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)