JW030B-M Lineage Power, JW030B-M Datasheet - Page 17

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JW030B-M

Manufacturer Part Number
JW030B-M
Description
CONVERTER DC/DC 12V 30W OUT
Manufacturer
Lineage Power
Series
JW030r
Type
Isolated with Remote On/Offr
Datasheet

Specifications of JW030B-M

Output
12V
Number Of Outputs
1
Power (watts)
30W
Mounting Type
Through Hole
Voltage - Input
36 ~ 75V
Package / Case
9-DIP Module
1st Output
12 VDC @ 2.5A
Size / Dimension
2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
Power (watts) - Rated
30W
Operating Temperature
-40°C ~ 100°C
Efficiency
83%
Approvals
CE, CSA, UL, VDE
Output Power
30W
Output Current
3A
Input Voltage
48V
Output Voltage
12V
Screening Level
Industrial
Product Length (mm)
61mm
Product Height (mm)
12.7mm
Product Depth (mm)
57.9mm
Mounting Style
Through Hole
Pin Count
9
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
3rd Output
-
2nd Output
-
4th Output
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
JW030B-M
Manufacturer:
LUCENT
Quantity:
492
March 26,2008
Thermal Considerations
Heat Sink Selection
Figure 35. Case-to-Ambient Thermal Resistance
Lineage Power
8
7
6
5
4
3
2
1
0
0
vs. Air Velocity Curves; Either
Orientation
0.25
(50)
(100)
0.51
AIR VELOCITY, ms
(150)
0.76
(continued)
(200)
NO HEAT SINK
1/4 in. HEAT SINK
1/2 in. HEAT SINK
1 in. HEAT SINK
1 1/2 in. HEAT SINK
1.02
(250)
(continued)
1.27
-1
(ft./min.)
(300)
1.52
(350)
1.78
8-1052(C).a
(400)
2.03
Although the previous example uses 100 °C as the
maximum case temperature, for extremely high reliabil-
ity applications, one can use a lower temperature for
T
It is important to point out that the thermal resistances
shown in Figure 35 are for heat transfer from the sides
and bottom of the module as well as the top side with
the attached heat sink; therefore, the case-to-ambient
thermal resistances shown will generally be lower than
the resistance of the heat sink by itself. The data in Fig-
ure 35 was taken with a thermally conductive dry pad
between the case and the heat sink to minimize contact
resistance (typically 0.1 °C/W to 0.3 °C/W).
For a more detailed explanation of thermal energy
management for this series of power modules as well
as more details on available heat sinks, please request
the following technical note: Thermal Energy Manage-
ment for JC- and JW-Series 30 Watt Board-Mounted
Power Modules (TN97-016EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs.
C, max
.
36 Vdc to 75 Vdc Inputs; 30 W
17

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