ADP1613-12-EVALZ Analog Devices Inc, ADP1613-12-EVALZ Datasheet - Page 4

• Manufacturer Part Number: ADP1613-12-EVALZ
• Description: BOARD EVAL FOR ADP1613
• Manufacturer: Analog Devices Inc

Specifications of ADP1613-12-EVALZ

• Design Resources: Powering a 30V DAC from a 3V supply (CN0193)
• Main Purpose: DC/DC, Step Up
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 12V
• Current - Output: 2A
• Voltage - Input: 2.5 ~ 5.5V
• Regulator Topology: Boost
• Board Type: Fully Populated
• Utilized Ic / Part: ADP1613
• Silicon Manufacturer: Analog Devices
• Application Sub Type: Step Up DC/DC Converter
• Kit Application Type: Power Management - Voltage Regulator
• Silicon Core Number: ADP1613
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Frequency - Switching: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ADP1612/ADP1613
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, EN, FB to GND
FREQ to GND
COMP to GND
SS to GND
SW to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
ESD (Electrostatic Discharge)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination.
Human Body Model
Rating
−0.3 V to +6 V
−0.3 V to V
1.0 V to 1.6 V
−0.3 V to +1.3 V
21 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
±5 kV
IN
+ 0.3 V
Rev. B | Page 4 of 28
THERMAL RESISTANCE
Junction-to-ambient thermal resistance (θ
specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The junction-to-
ambient thermal resistance is highly dependent on the application
and board layout. In applications where high maximum power
dissipation exists, attention to thermal board design is required.
The value of θ
and environmental conditions.
Table 3.
Package Type
8-Lead MSOP
1
BOUNDARY CONDITION
Modeled under natural convection cooling at 25°C ambient
temperature, JESD 51-7, and 1 W power input with 2- and
4-layer boards.
ESD CAUTION
Thermal numbers per JEDEC standard JESD 51-7.
2-Layer Board
4-Layer Board
JA
1
1
may vary, depending on PCB material, layout,
θ
206.9
162.2
JA
JA
θ
44.22
44.22
) of the package is
JC
Unit
°C/W
°C/W