IRDC3841 International Rectifier, IRDC3841 Datasheet

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IRDC3841

Manufacturer Part Number
IRDC3841
Description
BOARD EVAL SYNC BUCK CONVERTER
Manufacturer
International Rectifier
Datasheets

Specifications of IRDC3841

Silicon Manufacturer
International Rectifier
Kit Contents
Board
Features
Compact, High Performance And Flexible Solution, 600kHz Frequency
Svhc
No SVHC (15-Dec-2010)
Core Architecture
Power Management -
Rohs Compliant
No
DESCRIPTION
The
converter,
performance and flexible solution in a small
5mmx6mm Power QFN package.
Key features offered by the IR3841 include
programmable soft-start ramp, precision
0.7V
thermal protection, programmable switching
frequency, Sequence input, Enable input,
input under-voltage lockout for proper start-
up, and pre-bias start-up.
BOARD FEATURES
02/02/2009
SupIRBuck
V
V
V
F
L= 1.0uH
C
C
s
in
cc
out
in
out
=600kHz
IR3841
= 4x10uF (ceramic 1206) + 330uF (electrolytic)
=+5V (5.5V Max)
reference
= +12V (13.2V Max)
= 6x22uF (ceramic 0805)
= +1.8V @ 0- 8A
USER GUIDE FOR IR3841 EVALUATION BOARD
providing
is
voltage,
a
synchronous
a
TM
compact,
Power
Good
buck
high
,
An output over-current protection function is
implemented by sensing the voltage developed
across the on-resistance of the synchronous
rectifier
performance.
This user guide contains the schematic and bill
of materials for the IR3841 evaluation board.
The guide describes operation and use of the
evaluation board itself. Detailed
information for IR3841 is available in the
IR3841 data sheet.
MOSFET
for
optimum
IRDC3841
application
cost
and
1

Related parts for IRDC3841

IRDC3841 Summary of contents

Page 1

... This user guide contains the schematic and bill of materials for the IR3841 evaluation board. , Good The guide describes operation and use of the evaluation board itself. Detailed information for IR3841 is available in the IR3841 data sheet. IRDC3841 for optimum cost and application 1 ...

Page 2

... For sequencing application, R16 should be Table I. Connections Signal Name V (+12V) in Ground Vcc input Ground for Vcc input Ground of V out V (+1.8V) out Enable Sequence Input Power Good Signal IRDC3841 The value of R14 2 ...

Page 3

... Connection Diagram Enable Seq AGND SS PGood Fig. 1: Connection diagram of IR384x evaluation boards 02/02/2009 Vin GND Vcc GND IRDC3841 GND Vo 3 ...

Page 4

... Fig. 3: Board layout, bottom overlay (rear view) 02/02/2009 Fig. 2: Board layout, top overlay IRDC3841 4 ...

Page 5

... Single point connection between AGND and PGND. AGND Plane 02/02/2009 Fig. 4: Board layout, mid-layer I. Fig. 5: Board layout, mid-layer II. IRDC3841 PGND Plane 5 ...

Page 6

... AGnd1 15 Boot Vcc PGood IRDC3841 ...

Page 7

... Thick Film, 0603,1/10W,1% 750 Thick Film, 0603,1/10W,1% 3.01k Thick Film, 0603,1/10W,1% 4.02k Thick Film, 0603,1/10W,1% 2.55k Thick Film, 0603,1/10W,1% IR3841 PQFN 6mmx5mm, 8A SupIRBuck IRDC3841 Manufacturer Part Number Panasonic EEV-FK1E331P Panasonic - ECG ECJ-GVB1A106M Panasonic - ECG ECJ-3YB1C106M Panasonic - ECG ECJ-1VB1E104K Murata GRM1885C1H222JA01D ...

Page 8

... Vin=12.0V, Vcc=5V, Vo=1.8V, Io=0-8A, Room Temperature, No Air Flow Fig. 7: Start Load out 3 ss Fig. 9: Start up with 1.62V Pre Bias, 0A Load out 3 Fig. 11: Inductor node at 8A load Ch :LX 3 02/02/2009 :Enable 4 SS IRDC3841 Fig. 8: Start Load out Fig. 10: Output Voltage Ripple, 8A load out Fig. 12: Short (Hiccup) Recovery out 3 ss ...

Page 9

... TYPICAL OPERATING WAVEFORMS Vin=12V, Vcc=5V, Vo=1.8V, Io=0-8A, Room Temperature, No Air Flow Fig. 13: Transient Response step 2.5A/us 02/02/2009 out 4 out IRDC3841 9 ...

Page 10

... TYPICAL OPERATING WAVEFORMS Vin=12V, Vcc=5V, Vo=1.8V, Io=8A, Room Temperature, No Air Flow Fig. 14: Bode Plot at 8A load shows a bandwidth of 127kHz and phase margin of 50 degrees 02/02/2009 IRDC3841 10 ...

Page 11

... Load Percentage (%) Fig.15: Efficiency versus load current Load Percentage (%) Fig.16: Power loss versus load current IRDC3841 100 100 11 ...

Page 12

... THERMAL IMAGES Vin=12V, Vo=1.8V, Io=8A, Room Temperature, No Air Flow Test points 1 and 2 are IR3841 and inductor, respectively. 02/02/2009 Fig. 17: Thermal Image at 8A load IRDC3841 12 ...

Page 13

... Vo. For the following test results a 0-3.3V source is applied to SEQ pin. - The controlling input should be applied after the SS pin is clamped to 3.0V. Fig. 18: Simultaneous Tracking a 3.3V input at power-up and shut-down 02/02/2009 Ch2: SEQ Ch3:Vout Ch4: SS IRDC3841 13 ...

Page 14

... The pad lands (the 4 big pads other than the 11 IC pins) length and width should be equal to maximum part pad length and width. However, the minimum metal to metal spacing should be no less than 0.17mm for 2 oz. Copper; no less than 0.1mm for 1 oz. Copper and no less than 0.23mm for 3 oz. Copper. 02/02/2009 IRDC3841 ...

Page 15

... Ensure that the solder resist in between the lead lands and the pad land is ≥ 0.15mm due to the high aspect ratio of the solder resist strip separating the lead lands from the pad land. 02/02/2009 IRDC3841 ...

Page 16

... The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus an annular 0.2mm pull back to decrease the incidence of shorting the center land to the lead lands when the part is pushed into the solder paste. 02/02/2009 IRDC3841 ...

Page 17

... This product has been designed and qualified for the Consumer market. 02/02/2009 BOTTOM VIEW 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 Visit us at www.irf.com for sales contact information Data and specifications subject to change without notice. 11/07 IRDC3841 TAC Fax: (310) 252-7903 ...

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