S201DH1F Sharp Microelectronics, S201DH1F Datasheet
S201DH1F
Specifications of S201DH1F
Related parts for S201DH1F
S201DH1F Summary of contents
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... S101DH1 Series and S201DH1 Series Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac. These devices are ideally suited for controlling high voltage AC loads with solid state reliability while providing 4.0kV isolation (V (rms) ) from input to iso output. ■ ...
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... Internal Connection Diagram ■ Outline Dimensions 1. Through-Hole [ex. S101DH1F] 16 Anode mark Product mass : approx. 1.22g 2. Through-Hole [ex. S201DH1F] 16 Anode mark Product mass : approx. 1.22g 9 Anode Output ( Cathode Output ( Gate Model No CSA mark ±0.25 2.54 Date code (2 digit) Factory identification mark ±0.5 19.82 ± ...
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Outline Dimensions 3. Through-Hole, TÜV approval model [ex. S201DH1H] 16 Anode mark Product mass : approx. 1.22g (Note) To radiate the heat, solder the lead pins on the pattern of the PCB without using a socket such that there ...
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Date code (2 digit) 1st digit Year of production A.D. A.D Mark Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Forward current Input Reverse voltage RMS ON-state current Peak one cycle surge current Output Repetitive S101DH1 peak OFF-state voltage S201DH1 *1 Isolation voltage Operating temperature Storage temperature *2 Soldering temperature * 60%RH, AC ...
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... Model Line-up (1) (Lead-free terminal components) Lead Form Through-Hole Sleeve Shipping Package 25pcs/sleeve TÜV DIN EN60950 - Approved (Basic insulation class) S101DH1F - Model No. S201DH1F S201DH1H ■ Model Line-up (2) (Lead solder plating components) Lead Form Through-Hole Sleeve Shipping Package 25pcs/sleeve TÜV DIN EN60950 - Approved (Basic insulation class) S101DH1 - Model No ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Forward Current vs. Forward Voltage 25˚C 0˚C 100 T =75˚ −25˚C 50˚ ...
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Fig.6 Relative Holding Current vs. Ambient Temperature 1 000 100 10 −40 − Ambient temperature T Fig.8-a Turn-on Time vs. Forward Current (S101DH1) 1 000 100 Forward current I (mA) ...
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Design Considerations ● Recommended Operating Conditions Parameter Input signal current at ON state Input Input signal current at OFF state S101DH1 Load supply voltage S201DH1 Output Load supply current Frequency Operating temperature ∗ See Fig.2 about derating ...
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Standard Circuit Tr1 ✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes. Load 2 13 SSR Line Surge absorption circuit (Snubber ...
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Manufacturing Guidelines ● Soldering Method Flow Soldering : Flow soldering should be completed below 260˚C and within 10s. Preheating is within the bounds of 100 to 150˚C and 30 to 80s. Please solder within one time. Hand soldering Hand ...
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Cleaning instructions Solvent cleaning : Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less. Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning ...
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Package specification ● Sleeve package Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 25pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...